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347981-1

Description
SOCKET, DIP20, IC SOCKET
CategoryThe connector    socket   
File Size105KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

347981-1 Overview

SOCKET, DIP20, IC SOCKET

347981-1 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresSTANDARD PROFILE, VERTICAL MOUNT, DIP SOCKET
Contact to complete cooperationGOLD (10)
Contact completed and terminatedTIN LEAD OVER NICKEL
Device slot typeIC SOCKET
Type of equipment usedDIP20
JESD-609 codee0
Manufacturer's serial number347981
Number of contacts20
Base Number Matches1
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347981-1 Product Details
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347981-1
T E I nternal N umber: 3 4 7 9 8 1 - 1
Product Highlights:
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DIP Socket
l
Number of Positions = 20
l
Row-to-Row Spacing = 10.16 mm
l
Through Hole C ontact Termination Type
l
Mount Style = Vertical
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Obsolete
C ontact Product Information
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
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Product Line Information
Related Products:
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Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= DIP Socket
l
Number of Positions
= 20
l
Profile = Standard
l
Frame Style
= Ladder
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Leg Style
= Straight
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in])
= 2.84 [0.112]
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Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 10.16 [0.400]
l
Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Mating Area Plating Material
= Gold (10)
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 2.90 [0.114]
Industry Standards:
l
RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
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Packaging Method
= Tube
Other:
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Brand = AMP
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2009 Tyco Electronics C orporation All Rights Reserved
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Index Files: 1842  1790  2694  1488  2149  38  37  55  30  44 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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