The UT54ACS74 and the UT54ACTS74 contain two indepen-
dent D-type positive triggered flip-flops. A low level at the
Preset or Clear inputs sets or resets the outputs regardless of the
levels of the other inputs. When Preset and Clear are inactive
(high), data at the D input meeting the setup time requirement
is transferred to the outputs on the positive-going edge of the
clock pulse. Following the hold time interval, data at the D
input may be changed without affecting the levels at the outputs.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
INPUTS
PRE
L
H
L
H
H
H
CLR
H
L
L
H
H
H
CLK
X
X
X
↑
↑
L
D
X
X
X
H
L
X
OUTPUT
Q
H
L
H
1
PINOUTS
14-Pin DIP
Top View
CLR1
D1
CLK1
PRE1
Q1
Q1
V
SS
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
CLR2
D2
CLK2
PRE2
Q2
Q2
14-Lead Flatpack
Top View
CLR1
D1
CLK1
PRE1
Q1
Q1
V
SS
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
CLR2
D2
CLK2
PRE2
Q2
Q2
LOGIC SYMBOL
PRE1
CLK1
D1
CLR1
PRE2
CLK2
D2
CLR2
(4)
(3)
(2)
(1)
(10)
(11)
(12)
(13)
(9)
(8)
Q2
Q2
S
C1
D1
R
(5)
(6)
Q1
Q1
Q
L
H
H
L
H
Q
o
1
H
L
Q
o
Note:
1. The output levels in this configuration are not guaranteed to meet the minimum
levels for V
OH
if the lows at preset and clear are near V
IL
maximum. In
addition, this configuration is nonstable; that is, it will not persist when either
preset or clear returns to its inactive (high) level.
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and IEC
Publication 617-12.
1
LOGIC DIAGRAM
PRE
CLR
Q
CLK
Q
D
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
1.9
10
1.6
mW/
MHz
μA
mA
-8
mA
.7V
DD
V
DD
- 0.25
-200
8
200
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
I
OS
I
OL
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
a frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
[b][url=https://e2echina.ti.com/blogs_/b/power_house/archive/2018/07/18/52841][font=微软雅黑][size=3]Switch tube driving scheme for power factor correction circuit[/size][/font][/url][/b][font=微软雅黑][size=...
A single-chip microcomputer, also known as a single-chip microcontroller, is not a chip that completes a certain logical function, but a computer system integrated into one chip. In general, a chip be...
The display driver calls the image in the file system to display it during loadingAfter the display driver is completed, I want to drop the //system1//xxxx.bmp picture and display it.
Has anyone done ...
According to the Arduino official blog ( https://blog.arduino.cc/2022/09/14/its-here-please-welcome-arduino-ide-2-0/ ), Arduino IDE 2.0 has been officially released. The following is the translation o...
When I use the emulator to program the controlsuit on a 28377S board, I get this error: C28xx_CPU1: File Loader: Verification failed: Values at address 0x000000000000000 do not match Please verify tar...
A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
In recent years, many people have switched to new energy vehicles, and this type of vehicle has indeed been highly sought after and is considered the future direction of automobile development, and...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
In camera and display systems, the demand for high-performance and low-power data interfaces is driving continuous technological evolution. The evolution of MIPI D-PHY and MIPI C-PHY clearly ...[Details]
Driven by business opportunities such as access to new markets and government initiatives like the Belt and Road Initiative, global expansion has become a significant trend for Chinese companies. C...[Details]
Introduction: Traditionally, lead-acid batteries have primarily been used to provide backup power and power regulation based on location. In typical applications, the battery's actual use (discharg...[Details]
Amid the increasing complexity of electronic system power management,
power architecture design
is undergoing a paradigm shift from experience-driven to tool-enabled.
Analog
Devices...[Details]
1. Introduction to power amplifier circuit
1. Generally speaking, the main function of a power amplifier circuit is to allow the load to obtain maximum power without distorting the signal or c...[Details]
Wireless Communications
Ethernet protocol
Touch screen and 200Smart
In real-world systems, multiple PLCs are distributed throughout a single workshop, centrally controlled by a...[Details]
Robots are rapidly being deployed in diverse scenarios. Flexible, easy-to-use, and fast-to-deploy robots can be quickly adapted to diverse application scenarios across various industries, making th...[Details]
Oslo, Norway – August 18, 2025 – Nordic Semiconductor ("Nordic"), a leading global provider of low-power wireless technology, announced that it will participate in the International Internet of Thi...[Details]
The functions are still useless. When will it be able to be clearly distinguished from smartphones?
Most consumers categorize their smartwatch purchases as a desire to try something new. A sig...[Details]
To address the challenges of traditional discrete solutions in the automotive intelligent actuator market, such as high complexity, high cost, and insufficient reliability,
Naxin Microelectroni...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
