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BZX84C33ET3

Description
33V, 0.225W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    diode   
File Size167KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

BZX84C33ET3 Overview

33V, 0.225W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, PLASTIC PACKAGE-3

BZX84C33ET3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerON Semiconductor
Parts packaging codeSOT-23
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other featuresUL RECOGNIZED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance80 Ω
JEDEC-95 codeTO-236AB
JESD-30 codeR-PDSO-G3
JESD-609 codee0
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation0.225 W
Certification statusNot Qualified
Nominal reference voltage33 V
surface mountYES
technologyZENER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature30
Maximum voltage tolerance6.06%
Working test current2 mA
Base Number Matches1
BZX84CxxxET1 Series,
SZBZX84CxxxET1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features
http://onsemi.com
3
Cathode
1
Anode
225 mW Rating on FR−4 or FR−5 Board
Zener Breakdown Voltage Range
2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
Peak Power
225 W (8
X
20
ms)
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
3
1
2
SOT−23
CASE 318
STYLE 8
MARKING DIAGRAM
xxx M
G
G
1
xxx
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1)
@ T
L
25°C
Total Power Dissipation on FR−5 Board,
(Note 2) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina Sub-
strate, (Note 3) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
P
pk
P
D
Max
225
Unit
W
ORDERING INFORMATION
Device
BZX84CxxxET1
BZX84CxxxET1G
225
1.8
556
300
2.4
417
−65
to
+150
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
SZBZX84CxxxET1G
BZX84CxxxET3
BZX84CxxxET3G
SZBZX84CxxxET3G
Package
SOT−23
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
Shipping
3000 / Tape &
Reel
3000 / Tape &
Reel
3000 / Tape &
Reel
R
qJA
P
D
10,000 / Tape &
Reel
SOT−23 10,000 / Tape &
(Pb−Free)
Reel
SOT−23 10,000 / Tape &
(Pb−Free)
Reel
R
qJA
T
J
, T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
©
Semiconductor Components Industries, LLC, 2011
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
November, 2011
Rev. 7
1
Publication Order Number:
BZX84C2V4ET1/D
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