NXP Semiconductors
Data Sheet: Technical Data
Document Number: MPC5510
Rev. 5, 7/2019
MPC5510
MAPBGA–208
MAPBGA–225
17 mm x 17 mm
15 mm x 15 mm
LQFP–144
QFN12
20 mm x 20
##_mm_x_##mmmm
LQFP–176
24 mm x 24 mm
PKG-TBD
## mm x ## mm
MPC5510 Microcontroller
Family Data Sheet
MPC5510 Family Features
• Single issue, 32-bit CPU core complex (e200z1)
– Compliant with the Power Architecture™ embedded
category
– Includes an instruction set enhancement allowing
variable length encoding (VLE) for code size footprint
reduction. With the optional encoding of mixed 16-bit
and 32-bit instructions, it is possible to achieve
significant code size footprint reduction.
• Up to 1.5-Mbyte on-chip flash with flash control unit
(FCU)
• Up to 80 Kbytes on-chip SRAM
• Memory protection unit (MPU) with up to sixteen region
descriptors and 32-byte region granularity
• Interrupt controller (INTC) capable of handling
selectable-priority interrupt sources
• Frequency modulated Phase-locked loop (FMPLL)
• Crossbar switch architecture for concurrent access to
peripherals, flash, or RAM from multiple bus masters
• 16-channel enhanced direct memory access controller
(eDMA)
• Boot assist module (BAM) supports internal flash
programming via a serial link (CAN or SCI)
• Timer supports input/output channels providing a range of
16-bit input capture, output compare, and pulse width
modulation functions (eMIOS200)
• Up to 40-channel 12-bit analog-to-digital converter (ADC)
• Up to four serial peripheral interface (DSPI) modules
• Media Local Bus (MLB) emulation logic (works with two
DSPIs, the e200z0, the eDMA, and system RAM to create
a 3-pin or 5-pin 256Fs MLB protocol)
• Up to eight serial communication interface (eSCI) modules
• Up to six enhanced full CAN (FlexCAN) modules with
configurable buffers
• One inter IC communication interface (I
2
C) module
SOT-343R
##_mm_x_##mm
TBD
• Up to 144 configurable general purpose pins supporting
input and output operations and 3.0V through 5.5V supply
levels
• Real-time counter (RTC_API) with clock source from
external 32-kHz crystal oscillator, internal 32-kHz or
16-MHz oscillator and supporting wake-up with selectable
1-second resolution and > 1-hour timeout, or 1-millisecond
resolution with maximum timeout of one second
• Up to eight periodic interrupt timers (PIT) with 32-bit
counter resolution
• Nexus development interface (NDI) per IEEE-ISTO
5001-2003 Class Two Plus standard
• Device/board test support per Joint Test Action Group
(JTAG) of IEEE (IEEE 1149.1)
• On-chip voltage regulator (VREG) for regulation of 5V
input to 1.5V and 3.3V internal supply levels
• Optional e200z0, second Power Architecture based I/O
processor with VLE instruction set
• Optional FlexRAY controller
• Optional external bus interface (EBI) module
This document contains information on a product under development. NXP reserves the
right to change or discontinue this product without notice.
Table of Contents
1
Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .4
1.1 Signal Properties and Multiplexing Summary . . . . . . . . .4
1.2 Power and Ground Supply Summary . . . . . . . . . . . . . .15
1.3 Pinout – 144 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.4 Pinout – 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5 Pinout – 208 PBGA. . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
2.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .21
2.2.1 General Notes for Specifications at Maximum
Junction Temperature . . . . . . . . . . . . . . . . . . . .21
2.3 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .24
2.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .25
2.5 Operating Current Specifications
. . . . . . . . . . . . . .27
2.6 I/O Pad Current Specifications . . . . . . . . . . . . . . . . . . .29
2.7 Low Voltage Characteristics . . . . . . . . . . . . . . . . . . . . .30
2.8 Oscillators Electrical Characteristics. . . . . . . . . . . . . . .31
2.9 FMPLL Electrical Characteristics . . . . . . . . . . . . . . . . .33
2.10 eQADC Electrical Characteristics . . . . . . . . . . . . . . . . .34
2.11 Flash Memory Electrical Characteristics. . . . . . . . . . . .35
2.12 Pad AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . .36
2.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
2.13.1 Reset and Boot Configuration Pins . . . . . . . . . .37
2.13.2 External Interrupt (IRQ) and Non-Maskable
Interrupt (NMI) Pins . . . . . . . . . . . . . . . . . . . . .37
2.13.3 JTAG (IEEE 1149.1) Interface . . . . . . . . . . . . . .38
2.13.4 Nexus Debug Interface . . . . . . . . . . . . . . . . . . .41
2.13.5 External Bus Interface (EBI) . . . . . . . . . . . . . . .43
2.13.6 Enhanced Modular I/O Subsystem (eMIOS) . . .46
2.13.7 Deserial Serial Peripheral Interface (DSPI) . . . .47
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
4.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Table 13. 5V Low Frequency (32 kHz) Internal RC Oscillator . . . 32
Table 14. FMPLL Electrical Specifications . . . . . . . . . . . . . . . . . 33
Table 15. eQADC Conversion Specifications (Operating) . . . . . . 34
Table 16. Flash Program and Erase Specifications . . . . . . . . . . . 35
Table 17. Flash EEPROM Module Life (Full Temperature Range) 35
Table 18. Pad AC Specifications (VDDE = 3.0V - 5.5V) . . . . . . . 36
Table 19. Reset and Boot Configuration Timing . . . . . . . . . . . . . 37
Table 20. IRQ/NMI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 21. JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 22. Nexus Debug Port Timing . . . . . . . . . . . . . . . . . . . . . . 41
Table 23. External Bus Operation Timing . . . . . . . . . . . . . . . . . . 43
Table 24. eMIOS Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 25. DSPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 26. Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 27. Revision History of MPC5510 Data Sheet . . . . . . . . . . 53
2
List of Figures
Figure 1. MPC5510 Family Block Diagram . . . . . . . . . . . . . . . . . . 3
Figure 2. MPC5510 Pinout – 144 LQFP . . . . . . . . . . . . . . . . . . . 17
Figure 3. MPC5510 Pinout – 176 LQFP . . . . . . . . . . . . . . . . . . . 18
Figure 4. MPC5510 Pinout – 208 PBGA . . . . . . . . . . . . . . . . . . . 19
Figure 5. Pad Output Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 6. Reset and Boot Configuration Timing. . . . . . . . . . . . . . 37
Figure 7. IRQ and NMI Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 8. JTAG Test Clock Input Timing. . . . . . . . . . . . . . . . . . . . 38
Figure 9. JTAG Test Access Port Timing . . . . . . . . . . . . . . . . . . . 39
Figure 10. JTAG JCOMP Timing . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 11. JTAG Boundary Scan Timing . . . . . . . . . . . . . . . . . . . 40
Figure 12. Nexus Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 13. Nexus TDI, TMS, TDO Timing . . . . . . . . . . . . . . . . . . 42
Figure 14. CLKOUT Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 15. Synchronous Output Timing . . . . . . . . . . . . . . . . . . . . 44
Figure 16. Synchronous Input Timing . . . . . . . . . . . . . . . . . . . . . 45
Figure 17. Address Latch Enable (ALE) Timing . . . . . . . . . . . . . 46
Figure 18. DSPI Classic SPI Timing — Master, CPHA = 0 . . . . . 48
Figure 19. DSPI Classic SPI Timing — Master, CPHA = 1 . . . . . 48
Figure 20. DSPI Classic SPI Timing — Slave, CPHA = 0 . . . . . . 49
Figure 21. DSPI Classic SPI Timing — Slave, CPHA = 1 . . . . . . 49
Figure 22. DSPI Modified Transfer Format Timing — Master,
CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 23. DSPI Modified Transfer Format Timing — Master,
CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 24. DSPI Modified Transfer Format Timing — Slave, CPHA = 0
51
Figure 25. DSPI Modified Transfer Format Timing — Slave, CPHA = 1
51
Figure 26. DSPI PCS Strobe (PCSS) Timing . . . . . . . . . . . . . . . 51
3
4
List of Tables
Table 1. MPC5510 Signal Properties . . . . . . . . . . . . . . . . . . . . . . .4
Table 2. MPC5510 Power/Ground . . . . . . . . . . . . . . . . . . . . . . . .15
Table 3. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . .20
Table 4. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .21
Table 5. ESD Ratings, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Table 6. DC Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . .25
Table 7. Operating Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Table 8. I/O Pad Average DC Current . . . . . . . . . . . . . . . . . . . . . .29
Table 9. Low Voltage Monitors . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Table 10. 3.3V High Frequency External Oscillator. . . . . . . . . . . .31
Table 11. 5V Low Frequency (32 kHz) External Oscillator . . . . . .31
Table 12. 5V High Frequency (16 MHz) Internal RC Oscillator . . .32
MPC5510 Microcontroller Family Data Sheet, Rev. 5
2
NXP Semiconductors
Embedded System
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