AG103
Product Features
•
•
•
•
•
•
•
•
50 – 870 MHz
13 dB Gain
3 dB Noise Figure
>+36 dBm OIP3
+20 dBm P1dB
Single +5 Bias Supply
Internally matched to 50
Ω
Lead-free/Green/
RoHS-
compliant
SOT-89 Package
•
MTTF > 1000 years
The Communications Edge
TM
Product Information
High Dynamic Range Gain Block
Product Description
The AG103 is a general-purpose gain block that offers good
dynamic range and low noise figure in a low-cost surface-
mount package. The combination of high OIP3 and tight
gain variation window makes it attractive for a multitude of
applications. The device combines dependable performance
with superb quality to maintain MTTF values exceeding
1000 years at mounting temperatures of +85°C and is
available in both the standard SOT-89 package and the
environmentally-friendly lead-free/green/RoHS-compliant
and green SOT-89 package. All devices are 100% RF &
DC tested.
The AG103 uses a high reliability GaAs MMIC technology
and only requires DC-blocking and bypass capacitors, and
an inductive RF choke for operation. Internal matching
provides a 50 ohm input / output impedance minimizing the
number of required external components.
The AG103 GaAs MMIC amplifier is well suited for
wireless infrastructure such as NMT-450, homeland
security, and 2
nd
generation mobile infrastructure utilizing
the cellular band. In addition, the amplifier can be used for
applications in various IF frequency bands.
Functional Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Applications
•
•
•
•
Mobile Infrastructure
CATV / DBS
Defense / Homeland Security
NMT-450 Infrastructure
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise Figure
Operating Current Range
Supply Voltage
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
mA
V
Min
50
12
Typ
800
12.9
10
20
+20
>+36
2.9
150
+5
Max
870
14
Comment
See note 2
+33
120
Pout = +5 dBm/tone, 10 MHz spacing.
See note 2
180
1. Test conditions unless otherwise noted: T = 25º C, 50
Ω
system.
2. S11 and Noise Figure can be improved using an optional input matching network (typically just a series inductor).
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
-40 to +85
°C
-55 to +150
°C
+6 V
+10 dBm
+220° C
Ordering Information
Part No.
AG103
AG103-G
AG103-PCB
Rating
Description
GaAs MMIC Gain Block
(leaded SOT-89 Pkg)
GaAs MMIC Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
200 – 600 MHz Fully Assembled Application Circuit
Specifications and information are subject to change without notice.
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
September 2004
AG103
16
The Communications Edge
TM
Product Information
High Dynamic Range Gain Block
Typical Device Data
S-Parameters (V
DS
= +5 V, I
DS
= 150 mA, T = 25°C, unmatched 50 ohm system)
Gain
0
Return Loss
14
-10
12
Return Loss (dB)
Gain (dB)
-20
10
8
-30
DB(|S[2,1]|)
6
0
200
400
600
Frequency (MHz)
800
1000
-40
0
DB(|S[1,1]|)
200
DB(|S[2,2]|)
400
600
Frequency (MHz)
800
1000
The device can be used as a gain block with no input or output matching. For optimal input return loss and noise figure performance, the
amplifier can be slightly tuned for the frequency of operation as shown in the reference designs in this datasheet.
S-Parameters (V
DS
= +5 V, I
DS
= 150 mA, T = 25°C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
100
150
200
250
300
350
400
450
500
550
600
650
700
750
800
850
900
-11.30
-12.11
-12.46
-12.29
-12.35
-12.16
-12.14
-11.95
-11.88
-11.73
-11.60
-11.48
-11.26
-11.08
-10.90
-10.73
-10.51
-10.34
-30.04
-24.59
-25.65
-29.97
-32.81
-38.15
-42.37
-47.75
-52.03
-57.01
-61.03
-66.17
-70.02
-74.52
-79.00
-83.40
-87.42
-91.85
14.35
14.17
14.13
14.10
14.07
14.06
14.02
14.01
13.98
13.91
13.85
13.73
13.76
13.72
13.68
13.62
13.57
13.47
170.13
171.02
169.71
167.82
165.49
163.30
160.54
158.38
155.78
153.04
150.70
148.73
146.23
144.01
141.28
138.73
136.01
133.71
-20.20
-20.12
-20.08
-20.05
-19.99
-19.99
-20.01
-19.99
-20.01
-19.97
-19.95
-20.00
-20.03
-20.01
-19.93
-19.95
-19.94
-19.96
8.20
3.18
1.39
-0.31
-1.51
-2.59
-3.37
-4.74
-5.79
-6.12
-7.43
-8.03
-9.00
-9.46
-10.57
-11.34
-12.38
-12.95
-19.64
-22.19
-22.73
-23.12
-22.90
-23.03
-23.03
-22.80
-22.87
-22.90
-22.68
-22.48
-22.64
-22.19
-22.38
-22.12
-21.94
-21.78
-120.38
-142.79
-155.71
-160.90
-166.97
-167.62
-172.30
-173.68
-176.13
-176.83
179.96
178.91
177.09
176.83
175.26
173.64
172.78
171.76
Specifications and information are subject to change without notice.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
September 2004
AG103
The Communications Edge
TM
Product Information
High Dynamic Range Gain Block
Application Circuit: 200 – 600 MHz (AG103-PCB)
Typical Performance
Frequency
450 MHz
S21 - Gain
13.5 dB
S11
-23 dB
S22
-14 dB
Output P1dB
+21 dBm
Output IP3
+36 dBm
Noise Figure
2.7 dB
Bias
+5 V @ 150 mA
15
DB(|S[1,1]|) (R)
DB(|S[2,1]|) (L)
DB(|S[2,2]|) (R)
0
14
-5
S21 (dB)
13
-10
12
-15
11
-20
10
0
100
200
300
400
500
Frequency (MHz)
600
700
800
-25
+5 V
CAP
ID=C5
C=10000 pF
PORT
P=1
Z=50 Ohm
IND
ID=L1
L=12 nH
SUBCKT
ID=S1
NET="AG103"
IND
ID=L2
L=390 nH
size 0805
S11, S22 (dB)
PORT
P=2
Z=50 Ohm
CAP
ID=C1
C= 1000 pF
CAP
ID=C4
C=1000 pF
Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness
Notes:
1.
The amplifier should be connected directly to a +5 V regulator; no dropping resistor is required.
2.
If no DC signal is present at the input, C1 can be removed. The input is internally grounded in the amplifier.
3.
C2, C3, C5, & R1 are not used in the circuit. R2 is shorted across with 0
Ω
in the circuit. These placeholders shown in
the silkscreen are for applications with other devices.
Reference Design: 70 MHz
+5 V
CAP
ID=C5
C=1e4 pF
Reference Design: 900 MHz
+5 V
CAP
ID=C5
C=10000 pF
PORT
P=1
Z=50 Ohm
SUBCKT
ID=S1
NET="AG103"
IND
ID=L2
L=270 nH
PORT
P=2
Z=50 Ohm
PORT
P=1
Z=50 Ohm
SUBCKT
ID=S1
NET="AG103"
IND
ID=L2
L=100 nH
PORT
P=2
Z=50 Ohm
CAP
ID=C1
C=56 pF
IND
ID=L3
L=150 nH
CAP
ID=C4
C=1000 pF
CAP
ID=C1
C=100 pF
IND
ID=L3
L=15 nH
CAP
ID=C4
C=100 pF
15
DB(|S[1,1]|) * (R)
DB(|S[2,1]|) * (L)
DB(|S[2,2]|) (R)
0
15
DB(|S[1,1]|) * (R)
DB(|S[2,1]|) * (L)
DB(|S[2,2]|) * (R)
0
14
-5
14
-5
S11, S22 (dB)
S21 (dB)
S21 (dB)
13
-10
13
-10
12
-15
12
-15
11
-20
11
-20
10
50
100
150
Frequency (MHz)
200
250
-25
10
600
700
800
900
1000
Frequency (MHz)
1100
-25
1200
Specifications and information are subject to change without notice.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
September 2004
S11, S22 (dB)
AG103
The Communications Edge
TM
Product Information
High Dynamic Range Gain Block
AG103 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The AG103 will be marked with an “AG103”
designator.
An alphanumeric lot code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Land Pattern
MSL Rating: Level 3 at +235° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
MTTF vs. GND Tab Temperature
1000
-40 to +85°C
59° C / W
129° C
M T T F (m illio n h rs )
Rating
100
10
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
°C.
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
September 2004
AG103
The Communications Edge
TM
Product Information
High Dynamic Range Gain Block
AG103-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG103-G will be marked with
“103G” designator. An alphanumeric
code (“XXXX-X”) is also marked below
part designator on the top surface of
package.
an
lot
the
the
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes 500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes 1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
MTTF vs. GND Tab Temperature
1000
-40 to +85°C
59° C / W
129° C
M T T F (m illio n h rs )
Rating
100
10
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
°C.
1
60
70
80
90
100
Tab Temperature (°C)
110
Specifications and information are subject to change without notice.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
September 2004
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