H
Subminiature LED Lamps
Technical Data
HLMP-PXXX Series
HLMP-QXXX Series
HLMP-6XXX Series
HLMP-70XX Series
Features
• Subminiature Flat Top
Package
Ideal for Backlighting and
Light Piping Applications
• Subminiature Dome
Package
Diffused Dome for Wide
Viewing Angle
Nondiffused Dome for High
Brightness
• Arrays
• TTL and LSTTL
Compatible 5 Volt Resistor
Lamps
• Available in Six Colors
• Ideal for Space Limited
Applications
• Axial Leads
• Available with Lead
Configurations for Surface
Mount and Through Hole
PC Board Mounting
Dome Packages
The HLMP-6XXX Series dome
lamps for use as indicators use
a tinted, diffused lens to provide
a wide viewing angle with a
high on-off contrast ratio. High
brightness lamps use an
untinted, nondiffused lens to
provide a high luminous
intensity within a narrow
radiation pattern.
Arrays
The HLMP-66XX Series
subminiature lamp arrays are
available in lengths of 3 to 8
elements per array. The
luminous intensity is matched
within an array to assure a 2.1
to 1.0 ratio.
Resistor Lamps
The HLMP-6XXX Series 5 volt
subminiature lamps with built
in current limiting resistors are
for use in applications where
space is at a premium.
Lead Configurations
All of these devices are made by
encapsulating LED chips on
axial lead frames to form molded
epoxy subminiature lamp
packages. A variety of package
configuration options is avail-
able. These include special
surface mount lead configura-
tions, gull wing, yoke lead or Z-
bend. Right angle lead bends at
2.54 mm (0.100 inch) and
5.08 mm (0.200 inch) center
spacing are available for
through hole mounting. For
more information refer to
Standard SMT and Through
Hole Lead Bend Options for
Subminiature LED Lamps data
sheet.
Description
Flat Top Package
The HLMP-PXXX Series flat top
lamps use an untinted, non-
diffused, truncated lens to
provide a wide radiation pattern
that is necessary for use in
backlighting applications. The
flat top lamps are also ideal for
use as emitters in light pipe
applications.
1-174
5964-9350E
Package Dimensions (cont.)
(B) Diffused and Nondiffused
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.
*Refer to Figure 1 for design concerns.
(C) Arrays
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.
Figure 1. Proper Right Angle Mounting to a PC Board to Prevent Protruding Cathode Tab from Shorting to Anode
Connection.
1-176
Absolute Maximum Ratings at T
A
= 25
°
C
Parameter
DC Forward Current
[1]
Peak Forward Current
[2]
DC Forward Voltage
(Resistor Lamps Only)
Reverse Voltage (I
R
= 100
µA)
Transient Forward Current
[3]
(10
µs
Pulse)
Operating Temperature Range:
Non-Resistor Lamps
Resistor Lamps
Storage Temperature Range
For Thru Hole Devices
Wave Soldering Temperature
[1.6 mm (0.063 in.) from body]
For Surface Mount Devices:
Convective IR
Vapor Phase
5
2000
-55 to
+100
5
500
-40 to
+100
Standard
Red
50
1000
DH AS
AlGaAs
Red
30
300
High
Eff.
Red
30
90
6
5
500
5
500
-55 to +100
-40 to +85
Orange
30
90
Yellow
20
60
6
5
500
High
Perf. Emerald
Green Green Units
30
90
6
5
500
-40 to
+100
-20 to
+85
°C
30
90
6
5
500
-20 to
+100
mA
mA
V
V
mA
°C
-55 to +100
260°C for 5 Seconds
235°C for 90 Seconds
215°C for 3 Minutes
Notes:
1. See Figure 5 for current derating vs. ambient temperature. Derating is not applicable to resistor lamps.
2. Refer to Figure 6 showing Max. Tolerable Peak Current vs. Pulse Duration to establish pulsed operating conditions.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without failure. Do not
operate these lamps at this high current.
1-177
DSP and ARM Processors
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