|
5962R9093401QEA |
5962R9093401QFA |
54ACT399LMQB |
5962R9093401Q2A |
54ACT399MW8 |
| Description |
IC ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16, FF/Latch |
IC ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16, CERAMIC, DFP-16, FF/Latch |
IC ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, FF/Latch |
IC ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, FF/Latch |
IC ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, UUC, WAFER, FF/Latch |
| package instruction |
DIP, DIP16,.3 |
DFP, FL16,.3 |
QCCN, LCC20,.35SQ |
QCCN, LCC20,.35SQ |
DIE, |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
| series |
ACT |
ACT |
ACT |
ACT |
ACT |
| JESD-30 code |
R-GDIP-T16 |
R-GDFP-F16 |
S-CQCC-N20 |
S-CQCC-N20 |
X-XUUC-N |
| Logic integrated circuit type |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
| Number of digits |
4 |
4 |
4 |
4 |
4 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
| Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
| Package body material |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
UNSPECIFIED |
| encapsulated code |
DIP |
DFP |
QCCN |
QCCN |
DIE |
| Package shape |
RECTANGULAR |
RECTANGULAR |
SQUARE |
SQUARE |
UNSPECIFIED |
| Package form |
IN-LINE |
FLATPACK |
CHIP CARRIER |
CHIP CARRIER |
UNCASED CHIP |
| propagation delay (tpd) |
10 ns |
10 ns |
10 ns |
10 ns |
10 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
| Terminal form |
THROUGH-HOLE |
FLAT |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal location |
DUAL |
DUAL |
QUAD |
QUAD |
UPPER |
| Trigger type |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
| minfmax |
95 MHz |
95 MHz |
90 MHz |
95 MHz |
90 MHz |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
- |
| Other features |
FOUR 2:1 MUX FOLLOWED BY REGISTER |
FOUR 2:1 MUX FOLLOWED BY REGISTER |
FOUR 2:1 MUX FOLLOWED BY REGISTER |
FOUR 2:1 MUX FOLLOWED BY REGISTER |
- |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
- |
| length |
19.43 mm |
9.6645 mm |
8.89 mm |
8.89 mm |
- |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
- |
| Maximum Frequency@Nom-Sup |
90000000 Hz |
90000000 Hz |
- |
90000000 Hz |
- |
| MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
0.024 A |
- |
| Number of terminals |
16 |
16 |
20 |
20 |
- |
| Encapsulate equivalent code |
DIP16,.3 |
FL16,.3 |
LCC20,.35SQ |
LCC20,.35SQ |
- |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| power supply |
5 V |
5 V |
5 V |
5 V |
- |
| Prop。Delay @ Nom-Sup |
10 ns |
10 ns |
10 ns |
10 ns |
- |
| Filter level |
MIL-PRF-38535 Class Q |
MIL-PRF-38535 Class Q |
MIL-STD-883 Class B |
MIL-PRF-38535 Class Q |
- |
| Maximum seat height |
5.08 mm |
2.032 mm |
1.905 mm |
1.905 mm |
- |
| Terminal surface |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) - hot dipped |
- |
| Terminal pitch |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
- |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| total dose |
100k Rad(Si) V |
100k Rad(Si) V |
- |
100k Rad(Si) V |
- |
| width |
7.62 mm |
6.604 mm |
8.89 mm |
8.89 mm |
- |