NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14, CERPACK-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DFP |
| package instruction | DFP, FL14,.3 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | F/FAST |
| JESD-30 code | R-GDFP-F14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 3 |
| Number of entries | 3 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| propagation delay (tpd) | 6.5 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 2.032 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 6.2865 mm |
| Base Number Matches | 1 |
| 54F10FM | 54F10LMQB | 54F10DM | 54F10LM | 54F10DMQB | 54F10FMQB | 74F10SJCX | 74F10SJC | |
|---|---|---|---|---|---|---|---|---|
| Description | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14, CERPACK-14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CQCC20, CERAMIC, LCC-20 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CQCC20, CERAMIC, LCC-20 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14, CERPACK-14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, PDSO14, 0.300 INCH, EIAJ, PLASTIC, SOP-14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, PDSO14, 0.300 INCH, EIAJ, PLASTIC, SOP-14 |
| Parts packaging code | DFP | QLCC | DIP | QLCC | DIP | DFP | SOIC | SOIC |
| package instruction | DFP, FL14,.3 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | QCCN, | DIP, DIP14,.3 | DFP, FL14,.3 | 0.300 INCH, EIAJ, PLASTIC, SOP-14 | SOP, |
| Contacts | 14 | 20 | 14 | 20 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| series | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 code | R-GDFP-F14 | S-CQCC-N20 | R-GDIP-T14 | S-CQCC-N20 | R-GDIP-T14 | R-GDFP-F14 | R-PDSO-G14 | R-PDSO-G14 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| Number of functions | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of entries | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 14 | 20 | 14 | 20 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DFP | QCCN | DIP | QCCN | DIP | DFP | SOP | SOP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | SMALL OUTLINE | SMALL OUTLINE |
| propagation delay (tpd) | 6.5 ns | 6.5 ns | 6.5 ns | 6.5 ns | 6.5 ns | 6.5 ns | 5.3 ns | 5.3 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.032 mm | 1.905 mm | 5.08 mm | 1.905 mm | 5.08 mm | 2.032 mm | 2.1 mm | 2.1 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | NO | YES | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal form | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| width | 6.2865 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm | 6.2865 mm | 5.3 mm | 5.3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible | incompatible | - | - |
| JESD-609 code | e0 | e0 | e0 | - | e0 | e0 | - | - |
| Encapsulate equivalent code | FL14,.3 | LCC20,.35SQ | DIP14,.3 | - | DIP14,.3 | FL14,.3 | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - |
| power supply | 5 V | 5 V | 5 V | - | 5 V | 5 V | - | - |
| Schmitt trigger | NO | NO | NO | - | NO | NO | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - |
| length | - | 8.89 mm | 19.43 mm | 8.89 mm | 19.43 mm | - | 10.1 mm | 10.1 mm |
Power technology
FPGA/CPLD
Sensor
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Embedded System
Embedded System
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