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5962-9060001PA

Description

5962-9060001PA amplifier basic information:

5962-9060001PA is an OPERATIONAL AMPLIFIER. The commonly used packaging method is CERDIP-8

5962-9060001PA amplifier core information:

The minimum operating temperature of 5962-9060001PA is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Maximum bias current at 25°C: 20 µA

The manufacturer's maximum slew rate for the 5962-9060001PA is 18 mA, while the minimum slew rate is 430 V/us.

The nominal supply voltage of 5962-9060001PA is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of 5962-9060001PA is 9000 µV (Input offset voltage: the compensation voltage between the two input terminals required to make the output terminal of the operational amplifier 0V (or close to 0V).) The width of 5962-9060001PA is: 7.62 mm .

Related dimensions of 5962-9060001PA:

5962-9060001PA has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

5962-9060001PA amplifier additional information:

5962-9060001PA adopts the CURRENT-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of 5962-9060001PA is: YES. Its temperature grade is: MILITARY. 5962-9060001PA is not Rohs certified.

The corresponding JESD-30 code is: R-GDIP-T8. The corresponding JESD-609 code is: e0. The packaging code of 5962-9060001PA is: DIP. The materials used in the 5962-9060001PA package are mostly CERAMIC and GLASS-SEALED. The package shape is RECTANGULAR.

The 5962-9060001PA package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.

CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size518KB,8 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Alternative parts:5962-9060001PA
Stay tuned Parametric Compare

5962-9060001PA Overview

5962-9060001PA amplifier basic information:

5962-9060001PA is an OPERATIONAL AMPLIFIER. The commonly used packaging method is CERDIP-8

5962-9060001PA amplifier core information:

The minimum operating temperature of 5962-9060001PA is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Maximum bias current at 25°C: 20 µA

The manufacturer's maximum slew rate for the 5962-9060001PA is 18 mA, while the minimum slew rate is 430 V/us.

The nominal supply voltage of 5962-9060001PA is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of 5962-9060001PA is 9000 µV (Input offset voltage: the compensation voltage between the two input terminals required to make the output terminal of the operational amplifier 0V (or close to 0V).) The width of 5962-9060001PA is: 7.62 mm .

Related dimensions of 5962-9060001PA:

5962-9060001PA has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

5962-9060001PA amplifier additional information:

5962-9060001PA adopts the CURRENT-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of 5962-9060001PA is: YES. Its temperature grade is: MILITARY. 5962-9060001PA is not Rohs certified.

The corresponding JESD-30 code is: R-GDIP-T8. The corresponding JESD-609 code is: e0. The packaging code of 5962-9060001PA is: DIP. The materials used in the 5962-9060001PA package are mostly CERAMIC and GLASS-SEALED. The package shape is RECTANGULAR.

The 5962-9060001PA package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.

5962-9060001PA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Parts packaging codeDIP
package instructionCERDIP-8
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureCURRENT-FEEDBACK
Maximum bias current (IIB) at 25C20 µA
Nominal Common Mode Rejection Ratio45 dB
frequency compensationYES
Maximum input offset voltage9000 µV
JESD-30 codeR-GDIP-T8
JESD-609 codee0
low-dissonanceNO
Negative supply voltage upper limit-7 V
Nominal Negative Supply Voltage (Vsup)-5 V
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply+-5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.08 mm
minimum slew rate430 V/us
Maximum slew rate18 mA
Supply voltage upper limit7 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
broadbandYES
width7.62 mm
Base Number Matches1

5962-9060001PA Related Products

5962-9060001PA CLC410AJE CLC410AJE-TR13 CLC410MDC CL410M01C
Description IC OP-AMP, 9000 uV OFFSET-MAX, CDIP8, CERDIP-8, Operational Amplifier IC OP-AMP, 5000 uV OFFSET-MAX, PDSO8, PLASTIC, SOIC-8, Operational Amplifier IC OP-AMP, 5000 uV OFFSET-MAX, 200 MHz BAND WIDTH, PDSO8, 0.150 INCH, PLASTIC, SOIC-8, Operational Amplifier IC OP-AMP, 5000 uV OFFSET-MAX, UUC7, Operational Amplifier IC OP-AMP, 5000 uV OFFSET-MAX, UUC7, DIE, Operational Amplifier
Parts packaging code DIP SOIC SOIC WAFER WAFER
package instruction CERDIP-8 SOP, SOP8,.25 SOP, SOP8,.25 DIE, DIE
Contacts 8 8 8 7 7
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Nominal Common Mode Rejection Ratio 45 dB 50 dB 50 dB 50 dB 50 dB
Maximum input offset voltage 9000 µV 5000 µV 5000 µV 5000 µV 5000 µV
JESD-30 code R-GDIP-T8 R-PDSO-G8 R-PDSO-G8 X-XUUC-N7 X-XUUC-N7
Nominal Negative Supply Voltage (Vsup) -5 V -5 V -5 V -5 V -5 V
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 7 7
Package body material CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED
encapsulated code DIP SOP SOP DIE DIE
Package shape RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED UNSPECIFIED
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE UNCASED CHIP UNCASED CHIP
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Supply voltage upper limit 7 V 7 V 7 V 7 V 7 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES YES
Terminal form THROUGH-HOLE GULL WING GULL WING NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL UPPER UPPER
Base Number Matches 1 1 1 1 1
Is it Rohs certified? incompatible incompatible incompatible - -
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) -
Architecture CURRENT-FEEDBACK CURRENT-FEEDBACK CURRENT-FEEDBACK - -
Maximum bias current (IIB) at 25C 20 µA 20 µA 20 µA - -
frequency compensation YES YES YES - -
JESD-609 code e0 e0 e0 - -
low-dissonance NO NO NO - -
Negative supply voltage upper limit -7 V -7 V - -7 V -7 V
Maximum operating temperature 125 °C 85 °C 85 °C - -
Minimum operating temperature -55 °C -40 °C -40 °C - -
Encapsulate equivalent code DIP8,.3 SOP8,.25 SOP8,.25 - -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
power supply +-5 V +-5 V +-5 V - -
Maximum seat height 5.08 mm 1.75 mm 1.75 mm - -
minimum slew rate 430 V/us 430 V/us 430 V/us - -
Maximum slew rate 18 mA 18 mA 18 mA - -
technology BIPOLAR BIPOLAR BIPOLAR - -
Temperature level MILITARY INDUSTRIAL INDUSTRIAL - -
Terminal surface Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - -
Terminal pitch 2.54 mm 1.27 mm 1.27 mm - -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
broadband YES YES YES - -
width 7.62 mm 3.9 mm 3.9 mm - -
Maximum average bias current (IIB) - 20 µA - 20 µA 20 µA
Nominal slew rate - 700 V/us 700 V/us 1600 V/us 1600 V/us
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