Bit-Slice Processor, CMOS, CDIP64
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Dynex |
| package instruction | DIP, DIP64,.9 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T64 |
| JESD-609 code | e0 |
| Number of terminals | 64 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP64,.9 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum slew rate | 35 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR |
| Base Number Matches | 1 |
| MAQ17501CBBAF | MAS17501CSBAF | MAS17501CBBAF | MAS17501FSBAF | MAR17501LBBAF | MAR17501FSBAF | MAQ17501FBBAF | MAR17501FBBAF | MAR17501LSBAF | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Bit-Slice Processor, CMOS, CDIP64 | Bit-Slice Processor, CMOS, CDIP64 | Bit-Slice Processor, CMOS, CDIP64 | Bit-Slice Processor, CMOS, CQFP68 | Bit-Slice Processor, CMOS, CQCC64 | Bit-Slice Processor, CMOS, CQFP68 | Bit-Slice Processor, CMOS, CQFP68 | Bit-Slice Processor, CMOS, CQFP68 | Bit-Slice Processor, CMOS, CQCC64 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP64,.9 | DIP, DIP64,.9 | DIP, DIP64,.9 | QFF, QFL68,.95SQ | QCCN, LCC64,.7SQ,40 | QFF, QFL68,.95SQ | QFF, QFL68,.95SQ | QFF, QFL68,.95SQ | QCCN, LCC64,.7SQ,40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T64 | R-XDIP-T64 | R-XDIP-T64 | S-XQFP-F68 | S-XQCC-N64 | S-XQFP-F68 | S-XQFP-F68 | S-XQFP-F68 | S-XQCC-N64 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 64 | 64 | 64 | 68 | 64 | 68 | 68 | 68 | 64 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | QFF | QCCN | QFF | QFF | QFF | QCCN |
| Encapsulate equivalent code | DIP64,.9 | DIP64,.9 | DIP64,.9 | QFL68,.95SQ | LCC64,.7SQ,40 | QFL68,.95SQ | QFL68,.95SQ | QFL68,.95SQ | LCC64,.7SQ,40 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535V;38534K;883S |
| Maximum slew rate | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | FLAT | FLAT | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
| Maker | Dynex | Dynex | Dynex | - | - | Dynex | Dynex | Dynex | Dynex |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
京公网安备 11010802033920号
EEWORLD
