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5962-8761301CX

Description
AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
Categorylogic    logic   
File Size75KB,3 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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5962-8761301CX Overview

AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14

5962-8761301CX Parametric

Parameter NameAttribute value
MakerTexas Instruments
package instructionDIP,
Reach Compliance Codeunknown
seriesAC
JESD-30 codeR-GDIP-T14
length19.43 mm
Logic integrated circuit typeNAND GATE
Number of functions2
Number of entries4
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
propagation delay (tpd)7 ns
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1

5962-8761301CX Related Products

5962-8761301CX 5962-87613012X 74AC20SJ 74AC20SJX 74AC20SJQR
Description AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 AC SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 AC SERIES, DUAL 4-INPUT NAND GATE, PDSO14, EIAJ, SOIC-14 AC SERIES, DUAL 4-INPUT NAND GATE, PDSO14, EIAJ, SOIC-14 AC SERIES, DUAL 4-INPUT NAND GATE, PDSO14, EIAJ, SOIC-14
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, QCCN, SOP, SOP, SOP,
Reach Compliance Code unknown unknown unknown unknown unknown
series AC AC AC AC AC
JESD-30 code R-GDIP-T14 S-CQCC-N20 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
length 19.43 mm 8.89 mm 10.11 mm 10.11 mm 10.11 mm
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of functions 2 2 2 2 2
Number of entries 4 4 4 4 4
Number of terminals 14 20 14 14 14
Maximum operating temperature 125 °C 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature -55 °C -55 °C -40 °C -40 °C -40 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP QCCN SOP SOP SOP
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
propagation delay (tpd) 7 ns 7 ns 7 ns 7 ns 7 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 1.905 mm 2.108 mm 2.108 mm 2.108 mm
Maximum supply voltage (Vsup) 6 V 6 V 6 V 6 V 6 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE NO LEAD GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL QUAD DUAL DUAL DUAL
width 7.62 mm 8.89 mm 5.3 mm 5.3 mm 5.3 mm
Base Number Matches 1 1 1 1 1
Parts packaging code - - SOIC SOIC SOIC
Contacts - - 14 14 14
Load capacitance (CL) - - 50 pF 50 pF 50 pF
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