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M36W832TE

Description
32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
File Size319KB,64 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M36W832TE Overview

32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product

M36W832TE
M36W832BE
32 Mbit (2Mb x16, Boot Block) Flash Memory
and 8 Mbit (512Kb x16) SRAM, Multiple Memory Product
FEATURES SUMMARY
s
SUPPLY VOLTAGE
– V
DDF
= 2.7V to 3.3V
– V
DDS
= V
DDQF
= 2.7V to 3.3V
– V
PPF
= 12V for Fast Program (optional)
s
s
s
Figure 1. Packages
ACCESS TIMES: 70ns and 85ns
LOW POWER CONSUMPTION
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Top Device Code, M36W832TE: 88BAh
– Bottom Device Code, M36W832BE: 88BBh
Stacked LFBGA66 (ZA)
12 x 8mm
FBGA
FLASH MEMORY
s
32 Mbit (2Mb x16) BOOT BLOCK
– 8 x 4 KWord Parameter Blocks (Top or
Bottom Location)
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PROGRAMMING TIME
– 10µs typical
– Double Word Programming Option
– Quadruple Word Programming Option
SRAM
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8 Mbit (512Kb x 16)
s
s
s
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BLOCK LOCKING
– All blocks locked at Power up
– Any combination of blocks can be locked
– WPF for Block Lock-Down
ACCESS TIME: 70ns
LOW V
DDS
DATA RETENTION: 1.5V
POWER DOWN FEATURES USING TWO
CHIP ENABLE INPUTS
s
s
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AUTOMATIC STANDBY MODE
PROGRAM and ERASE SUSPEND
100,000 PROGRAM/ERASE CYCLES per
BLOCK
COMMON FLASH INTERFACE
SECURITY
– 128 bit user programmable OTP cells
– 64 bit unique device identifier
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May 2003
1/64

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