M368L3223CTL-LB3 datasheet, PDF

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M368L3223CTL-LB3: Description256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity; Categorystorage storage; File Size86KB，12 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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M368L3223CTL-LB3 Overview

256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity

M368L3223CTL-LB3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	DIMM
package instruction	DIMM, DIMM184
Contacts	184
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.7 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N184
memory density	2147483648 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	184
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM184
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	2.5 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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M368L3223CTL

184pin Unbuffered DDR SDRAM MODULE

256MB DDR SDRAM MODULE

(32Mx64 based on 32Mx8 DDR SDRAM)

Unbuffered 184pin DIMM

64-bit Non-ECC/Parity

Revision 0.3

May. 2002

Rev. 0.3 May. 2002

M368L3223CTL-LB3 Related Products

	M368L3223CTL-LB3	M368L3223CTL	M368L3223CTL-CA2	M368L3223CTL-CB3	M368L3223CTL-CB0	M368L3223CTL-LB0	M368L3223CTL-LA2
Description	256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity	256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity	256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity	256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity	256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity	256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity	256MB DDR SDRAM MODULE Unbuffered 184pin DIMM 64-bit Non-ECC/Parity
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DIMM	-	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM184	-	DIMM, DIMM184	DIMM, DIMM184	DIMM, DIMM184	DIMM, DIMM184	DIMM, DIMM184
Contacts	184	-	184	184	184	184	184
Reach Compliance Code	unknown	-	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.7 ns	-	0.75 ns	0.7 ns	0.75 ns	0.75 ns	0.75 ns
Other features	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz	-	133 MHz	166 MHz	133 MHz	133 MHz	133 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N184	-	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184
memory density	2147483648 bit	-	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit
Memory IC Type	DDR DRAM MODULE	-	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	-	64	64	64	64	64
Number of functions	1	-	1	1	1	1	1
Number of ports	1	-	1	1	1	1	1
Number of terminals	184	-	184	184	184	184	184
word count	33554432 words	-	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words
character code	32000000	-	32000000	32000000	32000000	32000000	32000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32MX64	-	32MX64	32MX64	32MX64	32MX64	32MX64
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	-	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM184	-	DIMM184	DIMM184	DIMM184	DIMM184	DIMM184
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	2.5 V	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	-	8192	8192	8192	8192	8192
self refresh	YES	-	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	-	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	NO	-	NO	NO	NO	NO	NO
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	-	1	1	1	1	-

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