54F10/BDA datasheet, PDF - EEWORLD Datasheet

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54F10/BDA: DescriptionIC F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, Gate; Categorylogic logic; File Size82KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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54F10/BDA Overview

IC F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, Gate

54F10/BDA Parametric

Parameter Name	Attribute value
package instruction	DFP,
Reach Compliance Code	unknown
series	F/FAST
JESD-30 code	R-CDFP-F14
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Maximum supply current (ICC)	7.7 mA
propagation delay (tpd)	6.5 ns
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal form	FLAT
Terminal location	DUAL
Base Number Matches	1

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package instruction	DFP,	QCCN,	DFP,	QCCN,	DFP,	QCCN,	QCCN,	DIP,	DFP,	DIP,
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
series	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST
JESD-30 code	R-CDFP-F14	S-CQCC-N20	R-CDFP-F14	S-CQCC-N20	R-CDFP-F14	S-CQCC-N20	S-CQCC-N20	R-GDIP-T14	R-CDFP-F14	R-GDIP-T14
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NAND GATE	NAND GATE	AND GATE	AND GATE	AND GATE	AND GATE	NAND GATE	NAND GATE	NAND GATE	AND GATE
Number of functions	3	3	3	3	3	3	3	3	3	3
Number of entries	3	3	3	3	3	3	3	3	3	3
Number of terminals	14	20	14	20	14	20	20	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DFP	QCCN	DFP	QCCN	DFP	QCCN	QCCN	DIP	DFP	DIP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	FLATPACK	CHIP CARRIER	FLATPACK	CHIP CARRIER	CHIP CARRIER	IN-LINE	FLATPACK	IN-LINE
Maximum supply current (ICC)	7.7 mA	7.7 mA	9.7 mA	9.7 mA	9.7 mA	9.7 mA	7.7 mA	7.7 mA	7.7 mA	9.7 mA
propagation delay (tpd)	6.5 ns	6.5 ns	7.5 ns	7.5 ns	7.5 ns	7.5 ns	6.5 ns	6.5 ns	6.5 ns	7.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	NO	YES	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	NO LEAD	FLAT	NO LEAD	FLAT	NO LEAD	NO LEAD	THROUGH-HOLE	FLAT	THROUGH-HOLE
Terminal location	DUAL	QUAD	DUAL	QUAD	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1	1
Maximum seat height	-	-	2.159 mm	1.905 mm	-	-	1.905 mm	5.08 mm	2.159 mm	5.08 mm
Terminal pitch	-	-	1.27 mm	1.27 mm	-	-	1.27 mm	2.54 mm	1.27 mm	2.54 mm
width	-	-	6.2865 mm	8.89 mm	-	-	8.89 mm	7.62 mm	6.2865 mm	7.62 mm

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