AM30LV0064DJ40WEI datasheet, PDF

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AM30LV0064DJ40WEI: DescriptionFlash, 8MX8, 35ns, PBGA40, 8 X 15 MM, 0.80 MM PITCH, FBGA-40; Categorystorage storage; File Size1MB，39 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM30LV0064DJ40WEI Overview

Flash, 8MX8, 35ns, PBGA40, 8 X 15 MM, 0.80 MM PITCH, FBGA-40

AM30LV0064DJ40WEI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	BGA,
Contacts	40
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	35 ns
Other features	100K PROGRAM/ERASE CYCLES MIN; DATA RETENTION 10 YEARS
Data retention time - minimum	10
JESD-30 code	R-PBGA-B40
JESD-609 code	e0
memory density	67108864 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	40
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX8
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Programming voltage	3 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
type	NAND TYPE
Base Number Matches	1

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AM30LV0064DJ40WEI Related Products

	AM30LV0064DJ40WEI	AM30LV0064DJ40WEC	AM30LV0064DK40WEC	AM30LV0064DK40WEI
Description	Flash, 8MX8, 35ns, PBGA40, 8 X 15 MM, 0.80 MM PITCH, FBGA-40	Flash, 8MX8, 35ns, PBGA40, 8 X 15 MM, 0.80 MM PITCH, FBGA-40	Flash, 8MX8, 35ns, PBGA40, 8 X 15 MM, 0.80 MM PITCH, FBGA-40	Flash, 8MX8, 35ns, PBGA40, 8 X 15 MM, 0.80 MM PITCH, FBGA-40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,
Contacts	40	40	40	40
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	35 ns	35 ns	35 ns	35 ns
Other features	100K PROGRAM/ERASE CYCLES MIN; DATA RETENTION 10 YEARS	100K PROGRAM/ERASE CYCLES MIN; DATA RETENTION 10 YEARS	100K PROGRAM/ERASE CYCLES MIN; DATA RETENTION 10 YEARS	100K PROGRAM/ERASE CYCLES MIN; DATA RETENTION 10 YEARS
Data retention time - minimum	10	10	10	10
JESD-30 code	R-PBGA-B40	R-PBGA-B40	R-PBGA-B40	R-PBGA-B40
JESD-609 code	e0	e0	e0	e0
memory density	67108864 bit	67108864 bit	67108864 bit	67108864 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	40	40	40	40
word count	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	8000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C
organize	8MX8	8MX8	8MX8	8MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240
Programming voltage	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30
type	NAND TYPE	NAND TYPE	NAND TYPE	NAND TYPE
Base Number Matches	1	1	1	1

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