
TRANSISTOR 0.2 A, 300 V, PNP, Si, POWER TRANSISTOR, PLASTIC, MPT3, SMD, UPAK-3, BIP General Purpose Power
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| package instruction | PLASTIC, MPT3, SMD, UPAK-3 |
| Contacts | 3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Shell connection | COLLECTOR |
| Maximum collector current (IC) | 0.2 A |
| Collector-emitter maximum voltage | 300 V |
| Configuration | SINGLE |
| Minimum DC current gain (hFE) | 30 |
| JESD-30 code | R-PSSO-F3 |
| JESD-609 code | e3 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | PNP |
| Maximum power dissipation(Abs) | 1 W |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal surface | Tin (Sn) |
| Terminal form | FLAT |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| Nominal transition frequency (fT) | 15 MHz |
| Base Number Matches | 1 |

| BST16T/R | BST16-T | BST15,115 | BST16,115 | BST15-T | BST16 | BST15 | BST15T/R | |
|---|---|---|---|---|---|---|---|---|
| Description | TRANSISTOR 0.2 A, 300 V, PNP, Si, POWER TRANSISTOR, PLASTIC, MPT3, SMD, UPAK-3, BIP General Purpose Power | TRANSISTOR 1000 mA, 300 V, PNP, Si, SMALL SIGNAL TRANSISTOR, BIP General Purpose Small Signal | TRANS PNP 200V 0.2A SOT89 | TRANS PNP 300V 0.2A SOT89 | TRANSISTOR 1000 mA, 200 V, PNP, Si, SMALL SIGNAL TRANSISTOR, BIP General Purpose Small Signal | TRANSISTOR 0.2 A, 300 V, PNP, Si, POWER TRANSISTOR, BIP General Purpose Power | TRANSISTOR 0.2 A, 200 V, PNP, Si, POWER TRANSISTOR, BIP General Purpose Power | TRANSISTOR 0.2 A, 200 V, PNP, Si, POWER TRANSISTOR, PLASTIC, MPT3, SMD, UPAK-3, BIP General Purpose Power |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum collector current (IC) | 0.2 A | 1 A | 0.2 A | 0.2 A | 1 A | 0.2 A | 0.2 A | 0.2 A |
| Collector-emitter maximum voltage | 300 V | 300 V | 200 V | 300 V | 200 V | 300 V | 200 V | 200 V |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Minimum DC current gain (hFE) | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| JESD-30 code | R-PSSO-F3 | R-PSSO-F3 | R-PSSO-F3 | R-PSSO-F3 | R-PSSO-F3 | R-PSSO-F3 | R-PSSO-F3 | R-PSSO-F3 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Polarity/channel type | PNP | PNP | PNP | PNP | PNP | PNP | PNP | PNP |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| Terminal surface | Tin (Sn) | TIN | TIN | TIN | TIN | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| Terminal form | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Nominal transition frequency (fT) | 15 MHz | 15 MHz | 15 MHz | 15 MHz | 15 MHz | 15 MHz | 15 MHz | 15 MHz |
| package instruction | PLASTIC, MPT3, SMD, UPAK-3 | SMALL OUTLINE, R-PSSO-F3 | SMALL OUTLINE, R-PSSO-F3 | SMALL OUTLINE, R-PSSO-F3 | SMALL OUTLINE, R-PSSO-F3 | - | - | PLASTIC, MPT3, SMD, UPAK-3 |
| Shell connection | COLLECTOR | - | COLLECTOR | COLLECTOR | - | COLLECTOR | COLLECTOR | COLLECTOR |
| Maximum operating temperature | 150 °C | - | 150 °C | 150 °C | - | 150 °C | 150 °C | 150 °C |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum power dissipation(Abs) | 1 W | - | 1 W | 1 W | - | 1 W | 1 W | 1 W |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 | - | - |