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54ACTQ08FMQB-RH

Description
IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,FP,14PIN,CERAMIC
Categorylogic    logic   
File Size102KB,5 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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54ACTQ08FMQB-RH Overview

IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,FP,14PIN,CERAMIC

54ACTQ08FMQB-RH Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDFP, FL14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDFP-F14
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.024 A
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL14,.3
Package shapeRECTANGULAR
Package formFLATPACK
method of packingRAIL
power supply5 V
Prop。Delay @ Nom-Sup7.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Filter level38535Q/M;38534H;883B
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
total dose100k Rad(Si) V
Base Number Matches1

54ACTQ08FMQB-RH Related Products

54ACTQ08FMQB-RH 54ACTQ08DMQB-RH 54ACTQ08LMQB-RH
Description IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,FP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,DIP,14PIN,CERAMIC 54ACTQ08LMQB-RH
Is it Rohs certified? incompatible incompatible incompatible
package instruction DFP, FL14,.3 DIP, DIP14,.3 QCCN, LCC20,.35SQ
Reach Compliance Code unknown unknow unknown
JESD-30 code R-XDFP-F14 R-XDIP-T14 S-XQCC-N20
JESD-609 code e0 e0 e0
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type AND GATE AND GATE AND GATE
MaximumI(ol) 0.024 A 0.024 A 0.024 A
Number of terminals 14 14 20
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC CERAMIC
encapsulated code DFP DIP QCCN
Encapsulate equivalent code FL14,.3 DIP14,.3 LCC20,.35SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form FLATPACK IN-LINE CHIP CARRIER
method of packing RAIL RAIL RAIL
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES NO YES
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE NO LEAD
Terminal pitch 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL QUAD
total dose 100k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V
Base Number Matches 1 1 1
Prop。Delay @ Nom-Sup 7.5 ns - 7.5 ns
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