IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,FP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | AND GATE |
| MaximumI(ol) | 0.024 A |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| method of packing | RAIL |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 7.5 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 54ACTQ08FMQB-RH | 54ACTQ08DMQB-RH | 54ACTQ08LMQB-RH | |
|---|---|---|---|
| Description | IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,FP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,DIP,14PIN,CERAMIC | 54ACTQ08LMQB-RH |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DFP, FL14,.3 | DIP, DIP14,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknow | unknown |
| JESD-30 code | R-XDFP-F14 | R-XDIP-T14 | S-XQCC-N20 |
| JESD-609 code | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | AND GATE | AND GATE | AND GATE |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A |
| Number of terminals | 14 | 14 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | QCCN |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 | LCC20,.35SQ |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | FLATPACK | IN-LINE | CHIP CARRIER |
| method of packing | RAIL | RAIL | RAIL |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD |
| total dose | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
| Base Number Matches | 1 | 1 | 1 |
| Prop。Delay @ Nom-Sup | 7.5 ns | - | 7.5 ns |