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345908-1

Description
SOCKET, DIP24, IC SOCKET
CategoryThe connector    socket   
File Size105KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

345908-1 Overview

SOCKET, DIP24, IC SOCKET

345908-1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTE Connectivity
Reach Compliance Codeunknown
ECCN codeEAR99
Contact to complete cooperationGOLD (10)
Contact completed and terminatedTIN LEAD OVER NICKEL
Contact materialBERYLLIUM COPPER
Device slot typeIC SOCKET
Type of equipment usedDIP24
JESD-609 codee0
Manufacturer's serial number345908
Number of contacts24
Base Number Matches1
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345908-1 Product Details
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DIP Sockets
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345908-1
T E I nternal N umber: 3 4 5 9 0 8 - 1
Product Highlights:
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DIP Socket
l
Number of Positions = 24
l
Row-to-Row Spacing = 15.24 mm
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Surface Mount C ontact Termination Type
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Mount Style = Vertical
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Obsolete
C ontact Product Information
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
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None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
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Product Line Information
Related Products:
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Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= DIP Socket
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Number of Positions
= 24
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Profile = Standard
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Frame Style
= Open
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Leg Style
= Floating C ontacts
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
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Row-to-Row Spacing (mm [in])
= 15.24 [0.600]
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Mount Style
= Vertical
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C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
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C ontact Termination Type
= Surface Mount
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C ontact Base Material
= Beryllium C opper
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C ontact Mating Area Plating Material
= Gold (10)
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C ontact Style
= Screw Machine
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Mating C ontact Type
= Inner Spring
Configuration Related Features:
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Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
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RoHS/ELV C ompliance
= Not ELV/RoHS compliant
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Lead Free Solder Processes
= Wave solder capable to 240?C
Conditions for Usage:
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Temperature Range (?C ) = 105
Packaging Related Features:
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Packaging Method
= Tube
Other:
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Brand = AMP
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2009 Tyco Electronics C orporation All Rights Reserved
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Index Files: 2266  548  1611  2540  2627  46  12  33  52  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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