IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DS3625N/B+ | DS3625N/A+ | DS8802J/A+ | DS8802N/A+ | DS8802N/B+ | DS8806J/A+ | HCHP1206L1203GW | DS8806N/B+ | |
|---|---|---|---|---|---|---|---|---|
| Description | IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC | IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC | IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,16PIN,CERAMIC | IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,16PIN,PLASTIC | IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,16PIN,PLASTIC | IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 120000ohm, 200V, 2% +/-Tol, -200,200ppm/Cel, 1207, | IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | conform to | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | compliant | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e4 | e0 |
| Number of terminals | 8 | 8 | 16 | 16 | 16 | 14 | 2 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 155 °C | 70 °C |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMT | IN-LINE |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | METAL GLAZE/THICK FILM | BIPOLAR |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP14,.3 | - | DIP, DIP14,.3 |
| JESD-30 code | R-PDIP-T8 | R-PDIP-T8 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T14 | - | R-PDIP-T14 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | - | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | - | DIP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP14,.3 | - | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| surface mount | NO | NO | NO | NO | NO | NO | - | NO |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| Maker | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments |
| Is Samacsys | - | - | N | N | N | N | - | N |