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DS3625N/B+

Description
IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size182KB,4 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

DS3625N/B+ Overview

IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC

DS3625N/B+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP8,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T8
JESD-609 codee0
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

DS3625N/B+ Related Products

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Description IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,16PIN,CERAMIC IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,16PIN,PLASTIC IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,16PIN,PLASTIC IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC Fixed Resistor, Metal Glaze/thick Film, 0.25W, 120000ohm, 200V, 2% +/-Tol, -200,200ppm/Cel, 1207, IC,MOS-TO-TTL TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible conform to incompatible
Reach Compliance Code unknown unknown unknown unknown unknown unknown compliant unknown
JESD-609 code e0 e0 e0 e0 e0 e0 e4 e0
Number of terminals 8 8 16 16 16 14 2 14
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 155 °C 70 °C
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE SMT IN-LINE
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR METAL GLAZE/THICK FILM BIPOLAR
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Gold (Au) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb)
package instruction DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP14,.3 - DIP, DIP14,.3
JESD-30 code R-PDIP-T8 R-PDIP-T8 R-XDIP-T16 R-PDIP-T16 R-PDIP-T16 R-XDIP-T14 - R-PDIP-T14
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC - PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP DIP - DIP
Encapsulate equivalent code DIP8,.3 DIP8,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP14,.3 - DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
surface mount NO NO NO NO NO NO - NO
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE - THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm - 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL - DUAL
Base Number Matches 1 1 1 1 1 1 - 1
Maker - - Texas Instruments Texas Instruments Texas Instruments Texas Instruments - Texas Instruments
Is Samacsys - - N N N N - N
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