MT58LC256K18B3S27BDC7-9 datasheet, PDF

MT58LC256K18B3S27BDC7-9: DescriptionStandard SRAM, 256KX18, 9ns, CMOS; Categorystorage storage; File Size522KB，14 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT58LC256K18B3S27BDC7-9 Overview

Standard SRAM, 256KX18, 9ns, CMOS

Parameter Name	Attribute value
Maker	Micron Technology
package instruction	DIE,
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	9 ns
JESD-30 code	R-XUUC-N79
memory density	4718592 bit
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of ports	1
Number of terminals	79
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX18
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
Base Number Matches	1

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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