M28C16B
M28C17B
16 Kbit (2K x 8) Parallel EEPROM
With Software Data Protection
PRELIMINARY DATA
s
s
Fast Access Time: 90 ns at V
CC
=5V
Single Supply Voltage:
– 4.5 V to 5.5 V for M28CxxB
– 2.7 V to 3.6 V for M28CxxB-W
s
s
Low Power Consumption
Fast BYTE and PAGE WRITE (up to 64 Bytes)
– 3 ms at V
CC
=4.5 V
– 5 ms at V
CC
=2.7 V
s
Enhanced Write Detection and Monitoring:
– Data Polling
– Toggle Bit
– Page Load Timer Status
PLCC32 (K)
s
s
s
s
JEDEC Approved Bytewide Pin-Out
Software Data Protection
100000 Erase/Write Cycles (minimum)
Data Retention (minimum): 40 Years
DESCRIPTION
The M28C16B and M28C17B devices consist of
2048x8 bits of low power, parallel EEPROM, fabri-
cated with STMicroelectronics’ proprietary single
polysilicon CMOS technology. The devices offer
fast access time, with low power dissipation, and
require a single voltage supply.
Figure 1. Logic Diagram
VCC
Table 1. Signal Names
A0-A10
DQ0-DQ7
W
E
G
RB
V
CC
V
SS
Address Input
11
A0-A10
8
DQ0-DQ7
Data Input / Output
Write Enable
Chip Enable
Output Enable
Ready/Busy (M28C17B only)
Supply Voltage
Ground
W
E
G
M28C16B
M28C17B
RB
(M28C17B only)
VSS
AI02816
February 1999
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/17
M28C16B, M28C17B
Figure 2A. PLLC Connections
NC
NC
VCC
W
NC
A7
NC
Figure 2B. PLLC Connections
NC
RB
VCC
W
NC
1 32
A8
A9
NC
NC
G
A10
E
DQ7
DQ6
A6
A5
A4
A3
A2
A1
A0
NC
DQ0
A8
A9
NC
NC
G
A10
E
DQ7
DQ6
M28C17B
25
17
DQ1
DQ2
VSS
NC
DQ3
DQ4
DQ5
AI02817
AI02830
1 32
A6
A5
A4
A3
A2
A1
A0
NC
DQ0
9
M28C16B
25
9
17
DQ1
DQ2
VSS
NC
DQ3
DQ4
DQ5
Note: 1. NC = Not Connected
Note: 1. NC = Not Connected
The M28C17B is like the M28C16B in every way,
except that it has an extra ready/busy (RB) output.
The device has been designed to offer a flexible
microcontroller interface, featuring software hand-
shaking, with Data Polling and Toggle Bit. The de-
vice supports a 64 byte Page Write operation.
Software Data Protection (SDP) is also supported,
using the standard JEDEC algorithm.
SIGNAL DESCRIPTION
The external connections to the device are sum-
marized in Table 1, and their use in Table 3.
Addresses (A0-A10).
The address inputs are
used to select one byte from the memory array
during a read or write operation.
Data In/Out (DQ0-DQ7).
The contents of the data
byte are written to, or read from, the memory array
through the Data I/O pins.
Chip Enable (E).
The chip enable input must be
held low to enable read and write operations.
When Chip Enable is high, power consumption is
reduced.
Output Enable (G).
The Output Enable input con-
trols the data output buffers, and is used to initiate
read operations.
Write Enable (W).
The Write Enable input controls
whether the addressed location is to be read, from
or written to.
Ready/Busy (RB).
Ready/Busy (on the M28C17B
only) is an open drain output that can be used to
detect the end of the internal write cycle.
DEVICE OPERATION
In order to prevent data corruption and inadvertent
write operations, an internal V
CC
comparator in-
hibits the Write operations if the V
CC
voltage is
lower than V
WI
(see Table 4A). Once the voltage
applied on the V
CC
pin goes over the V
WI
thresh-
old (V
CC
>V
WI
), write access to the memory is al-
lowed after a time-out t
PUW
, as specified in Table
4A.
Further protection against data corruption is of-
fered by the E and W low pass filters: any glitch,
on the E and W inputs, with a pulse width less than
10 ns (typical) is internally filtered out to prevent
inadvertent write operations to the memory.
Read
The device is accessed like a static RAM. When E
and G are low, and W is high, the contents of the
addressed location are presented on the I/O pins.
Otherwise, when either G or E is high, the I/O pins
revert to their high impedance state.
Write
Write operations are initiated when both W and E
are low and G is high. The device supports both
W-controlled and E-controlled write cycles (as
shown in Figure 11 and Figure 12). The address is
latched during the falling edge of W or E (which
ever occurs later) and the data is latched on the
rising edge of W or E (which ever occurs first). Af-
ter a delay, t
WLQ5H
, that cannot be shorter than the
value specified in Table 10A, the internal write cy-
cle starts. It continues, under internal timing con-
trol, until the write operation is complete. The
commencement of this period can be detected by
reading the Page Load Timer Status on DQ5. The
2/17
A7
NC
M28C16B, M28C17B
Table 2. Absolute Maximum Ratings
1
Symbol
T
A
T
STG
V
CC
V
IO
V
I
V
ESD
Parameter
Ambient Operating Temperature
Storage Temperature
Supply Voltage
Input or Output Voltage
Input Voltage
Electrostatic Discharge Voltage (Human Body model)
2
Value
-40 to 125
-65 to 150
-0.3 to 6.5
-0.6 to V
CC
+0.6
-0.3 to 6.5
4000
Unit
°C
°C
V
V
V
V
Note: 1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only, and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-
tions for extended periods may affect device reliability. Refer also to the ST SURE Program and other relevant quality documents.
2. MIL-STD-883C, 3015.7 (100 pF, 1500
Ω)
Figure 3. Block Diagram
E
G
W
VPP GEN
RESET
CONTROL LOGIC
X DECODE
A6-A10
(Page Address)
ADDRESS
LATCH
16K ARRAY
A0-A5
ADDRESS
LATCH
Y DECODE
SENSE AND DATA LATCH
I/O BUFFERS
PAGE LOAD
TIMER STATUS
TOGGLE BIT
DATA POLLING
AI02818
DQ0-DQ7
3/17
M28C16B, M28C17B
Table 3. Operating Modes
1
Mode
Stand-by
Output Disable
Write Disable
Read
Write
Chip Erase
E
1
X
X
0
0
0
G
X
1
X
0
1
V
W
X
X
1
1
0
0
DQ0-DQ7
Hi-Z
Hi-Z
Hi-Z
Data Out
Data In
Hi-Z
Note: 1. 0=
V
IL
; 1=
V
IH
; X =
V
IH
or V
IL
; V=12V ± 5%.
end of the cycle can be detected by reading the
status of the Data Polling and the Toggle Bit func-
tions on DQ7 and DQ6.
Page Write
The Page Write mode allows up to 64 bytes to be
written on a single page in a single go. This is
achieved through a series of successive Write op-
erations, no two of which are separated by more
than the t
WLQ5H
value (as specified in Table 10A).
The page write can be initiated during any byte
write operation. Following the first byte write in-
struction the host may send another address and
data with a minimum data transfer rate of:
1/t
WLQ5H
.
The internal write cycle can start at any instant af-
ter t
WLQ5H
. Once initiated, the write operation is in-
ternally timed, and continues, uninterrupted, until
completion.
All bytes must be located on the same page ad-
dress (A10-A6 must be the same for all bytes).
Otherwise, the Page Write operation is not execut-
ed.
As with the single byte Write operation, described
above, the DQ5, DQ6 and DQ7 lines can be used
to detect the beginning and end of the internally
controlled phase of the Page Write cycle.
Software Data Protection (SDP)
The device offers a software-controlled write-pro-
tection mechanism that allows the user to inhibit all
write operations to the device. This can be useful
for protecting the memory from inadvertent write
cycles that may occur during periods of instability
(uncontrolled bus conditions when excessive
noise is detected, or when power supply levels are
outside their specified values).
By default, the device is shipped in the “unprotect-
ed” state: the memory contents can be freely
changed by the user. Once the Software Data Pro-
tection Mode is enabled, all write commands are
Table 4A. Power-Up Timing
1
for M28CxxB (5V range)
(T
A
= 0 to 70 °C or -40 to 85 °C; V
CC
= 4.5 to 5.5 V)
Symbol
t
PUR
t
PUW
V
WI
Parameter
Time Delay to Read Operation
Time Delay to Write Operation (once V
CC
≥
V
WI
)
Write Inhibit Threshold
3.0
Min.
Max.
1
10
4.2
Unit
µs
ms
V
Note: 1. Sampled only, not 100% tested.
Table 4B. Power-Up Timing
1
for M28CxxB-W (3V range)
(T
A
= 0 to 70 °C or -40 to 85 °C; V
CC
= 2.7 to 3.6 V)
Symbol
t
PUR
t
PUW
V
WI
Parameter
Time Delay to Read Operation
Time Delay to Write Operation (once V
CC
≥
V
WI
)
Write Inhibit Threshold
1.5
Min.
Max.
1
15
2.5
Unit
µs
ms
V
Note: 1. Sampled only, not 100% tested.
4/17
M28C16B, M28C17B
Figure 4. Software Data Protection Enable Algorithm and Memory Write
Write AAh in
Address 555h
Page Write
Timing
(see note 1)
Page Write
Timing
(see note 1)
Write AAh in
Address 555h
Write 55h in
Address 2AAh
Write 55h in
Address 2AAh
Write A0h in
Address 555h
Write A0h in
Address 555h
Write
is Enabled
SDP is set
Physical
Page Write
Instruction
Page Write
(1 up to 64 bytes)
SDP Enable Algorithm
Write to Memory
When SDP is SET
AI02819
Note: 1. The most significant address bits (A10 to A6) differ during these specific Page Write operations.
ignored, and have no effect on the memory con-
tents.
The device remains in this mode until a valid Soft-
ware Data Protection disable sequence is re-
ceived. The device reverts to its “unprotected”
state.
The status of the Software Data Protection (en-
abled or disabled) is represented by a non-volatile
latch, and is remembered across periods of the
power being off.
The Software Data Protection Enable command
consists of the writing of three specific data bytes
to three specific memory locations (each location
being on a different page), as shown in Figure 4.
Similarly to disable the Software Data Protection,
the user has to write specific data bytes into six dif-
ferent locations, as shown in Figure 6. This com-
plex series of operations protects against the
chance of inadvertent enabling or disabling of the
Software Data Protection mechanism.
Figure 6. Software Data Protection Disable
Algorithm
Write AAh in
Address 555h
Write 55h in
Address 2AAh
Figure 5. Status Bit Assignment
Page Write
Timing
Write 80h in
Address 555h
Write AAh in
Address 555h
DQ7
DP
DQ6
TB
DQ5
PLTS
DQ4
Hi-Z
DQ3
Hi-Z
DQ2
Hi-Z
DQ1
Hi-Z
DQ0
Hi-Z
Write 55h in
Address 2AAh
DP
TB
PLTS
Hi-Z
= Data Polling
= Toggle Bit
= Page Load Timer Status
= High impedance
AI02815
Write 20h in
Address 555h
Unprotected State
AI02820
5/17
stm32/stm8
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