BXY43
HiRel Silicon PIN Diode
•
HiRel Discrete and Microwave Semiconductor
•
Current controlled RF resistors for RF
attenuators and switches
•
High reverse voltage
•
Hermetically sealed microwave package
•
esa
Space Qualified
ESA/SCC Detail Spec. No.: 5513/030
Type Variant No.s 01 to 03
BXY43-T
BXY43-T1
BXY43-P1
1
2
BXY43-FP
1
1'
2
ESD
(
E
lectro
s
tatic
d
ischarge) sensitive device, observe handling precaution!
Type
BXY43-FP (ql)
BXY43-P1 (ql)
BXY43-T (ql)
BXY43-T1 (ql)
Package
FP
T2
T
T1
Configuration
single
single
single
single
Marking
-
-
-
-
(ql) Testing level: P: Professional testing
H: High Rel quality
S: Space quality
ES: ESA qualified
1
2007-08-20
BXY43
Maximum Ratings
Parameter
Symbol
V
R
I
F
P
tot
Value
Unit
Reverse voltage
Forward current
Total power dissipation
1)
BXY43-T
BXY43-T1
BXY43-P1
BXY43-FP
Junction temperature
Operating temperature range
Soldering temperature
2)
Storage temperature
Thermal Resistance
Parameter
Thermal resistance junction-case
BXY43-FP
BXY43-P1
BXY43-T
BXY43-T1
150
400
500
V
mA
mW
T
j
T
op
T
sol
T
stg
150
-55 ... 150
150
-65 ... 175
°C
°C
°C
Symbol
R
th(j-c)
Value
100
90
100
125
Unit
K/W
Electrical Characteristics
at
T
A
= 25°C, unless otherwise specified
Parameter
Symbol
Values
min.
typ. max.
DC Characteristics
Reverse current 1
I
R1
-
-
100
V
R1
= 150 V
Reverse current 2
V
R2
= 100 V
Forward voltage
I
F
= 100 mA
1
For
Unit
nA
I
R2
V
F
-
-
-
0.97
10
1
V
BXY43-FP, -T: At
T
CASE
= 100°C. For
T
CASE
> 100°C derating is required
For BXY43-P1: At
T
CASE
= 105°C. For
T
CASE
> 105°C derating is required
For BXY43-T1: At
T
CASE
= 87.5°C. For
T
CASE
> 87.5°C derating is required
2
During
5 sec. maximum. The terminal shall not be resoldered until 5 minutes have elapsed.
2
2007-08-20
BXY43
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
5
2007-08-20
Embedded System
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