MSM51V4170-80TS-L datasheet, PDF

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MSM51V4170-80TS-L: DescriptionFast Page DRAM, 256KX16, 80ns, CMOS, PDSO40; Categorystorage storage; File Size800KB，15 Pages; ManufacturerLAPIS Semiconductor Co., Ltd.

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MSM51V4170-80TS-L Overview

Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40

MSM51V4170-80TS-L Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LAPIS Semiconductor Co., Ltd.
package instruction	TSOP, TSOP40/44,.46,32
Reach Compliance Code	unknown
Maximum access time	80 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	FAST PAGE DRAM
memory width	16
Number of terminals	40
word count	262144 words
character code	256000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP
Encapsulate equivalent code	TSOP40/44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	1024
reverse pinout	YES
self refresh	NO
Maximum standby current	0.0005 A
Maximum slew rate	0.065 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Base Number Matches	1

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MSM51V4170-80TS-L Related Products

	MSM51V4170-80TS-L	MSM51V4170-80JS	MSM51V4170-80TS-K	MSM51V4170-70JS	MSM51V4170-70TS-L	MSM51V4170-70TS-K
Description	Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40	Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40	Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40	Fast Page DRAM, 256KX16, 70ns, CMOS, PDSO40	Fast Page DRAM, 256KX16, 70ns, CMOS, PDSO40	Fast Page DRAM, 256KX16, 70ns, CMOS, PDSO40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.
package instruction	TSOP, TSOP40/44,.46,32	SOJ, SOJ40,.44	TSOP, TSOP40/44,.46,32	SOJ, SOJ40,.44	TSOP, TSOP40/44,.46,32	TSOP, TSOP40/44,.46,32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	80 ns	80 ns	80 ns	70 ns	70 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G40	R-PDSO-J40	R-PDSO-G40	R-PDSO-J40	R-PDSO-G40	R-PDSO-G40
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	16	16	16	16	16	16
Number of terminals	40	40	40	40	40	40
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP	SOJ	TSOP	SOJ	TSOP	TSOP
Encapsulate equivalent code	TSOP40/44,.46,32	SOJ40,.44	TSOP40/44,.46,32	SOJ40,.44	TSOP40/44,.46,32	TSOP40/44,.46,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	1024	1024	1024	1024	1024	1024
self refresh	NO	NO	NO	NO	NO	NO
Maximum standby current	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A
Maximum slew rate	0.065 mA	0.065 mA	0.065 mA	0.08 mA	0.08 mA	0.08 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	J BEND	GULL WING	J BEND	GULL WING	GULL WING
Terminal pitch	0.8 mm	1.27 mm	0.8 mm	1.27 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1

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