54F433SDM datasheet, PDF - EEWORLD Datasheet

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54F433SDM: Description64X4 OTHER FIFO, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24; Categorystorage storage; File Size396KB，14 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54F433SDM Overview

64X4 OTHER FIFO, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24

54F433SDM Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-GDIP-T24
memory density	256 bit
Memory IC Type	OTHER FIFO
memory width	4
Number of functions	1
Number of terminals	24
word count	64 words
character code	64
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X4
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL/SERIAL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.715 mm
Maximum slew rate	0.215 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

54F433SDM Related Products

	54F433SDM	54F433FM	54F433LM	74F433QC
Description	64X4 OTHER FIFO, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24	64X4 OTHER FIFO, CDFP24, CERAMIC, FP-24	64X4 OTHER FIFO, CQCC28, CERAMIC, LCC-28	64X4 OTHER FIFO, PQCC28, PLASTIC, CC-28
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DFP	QLCC	QFN
package instruction	DIP, DIP24,.3	DFP, FL24,.4	QCCN, LCC28,.45SQ	QCCJ, LDCC28,.5SQ
Contacts	24	24	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-GDIP-T24	R-GDFP-F24	S-CQCC-N28	S-PQCC-J28
memory density	256 bit	256 bit	256 bit	256 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	4	4	4	4
Number of functions	1	1	1	1
Number of terminals	24	24	28	28
word count	64 words	64 words	64 words	64 words
character code	64	64	64	64
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-
organize	64X4	64X4	64X4	64X4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	DIP	DFP	QCCN	QCCJ
Encapsulate equivalent code	DIP24,.3	FL24,.4	LCC28,.45SQ	LDCC28,.5SQ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	FLATPACK	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL	PARALLEL/SERIAL
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	2.286 mm	1.905 mm	4.57 mm
Maximum slew rate	0.215 mA	0.215 mA	0.215 mA	0.215 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	FLAT	NO LEAD	J BEND
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	QUAD
width	7.62 mm	9.4615 mm	11.43 mm	11.43 mm
Base Number Matches	1	1	1	1
length	-	15.435 mm	11.43 mm	11.43 mm

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