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5430FMQB

Description
NAND Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDFP14, CERAMIC, FP-14
Categorylogic    logic   
File Size776KB,3 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

5430FMQB Overview

NAND Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDFP14, CERAMIC, FP-14

5430FMQB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeDFP
package instructionCERAMIC, FP-14
Contacts14
Reach Compliance Codeunknown
seriesTTL/H/L
JESD-30 codeR-GDFP-F14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of functions1
Number of entries8
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeQFF
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)NOT SPECIFIED
propagation delay (tpd)15 ns
Certification statusNot Qualified
Maximum seat height2.032 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width6.35 mm
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5430FMQB Related Products

5430FMQB DM7430N
Description NAND Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDFP14, CERAMIC, FP-14 NAND Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, PDIP14, PLASTIC, DIP-14
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Rochester Electronics Rochester Electronics
Parts packaging code DFP DIP
package instruction CERAMIC, FP-14 DIP,
Contacts 14 14
Reach Compliance Code unknown unknown
series TTL/H/L TTL/H/L
JESD-30 code R-GDFP-F14 R-PDIP-T14
JESD-609 code e0 e0
Logic integrated circuit type NAND GATE NAND GATE
Number of functions 1 1
Number of entries 8 8
Number of terminals 14 14
Maximum operating temperature 125 °C 70 °C
Package body material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code QFF DIP
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) 15 ns 15 ns
Certification status Not Qualified Not Qualified
Maximum seat height 2.032 mm 5.08 mm
Maximum supply voltage (Vsup) 5.5 V 5.25 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES NO
technology TTL TTL
Temperature level MILITARY COMMERCIAL
Terminal surface TIN LEAD TIN LEAD
Terminal form FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 6.35 mm 7.62 mm
Base Number Matches 1 1

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