5962-9062008MXX datasheet, PDF

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5962-9062008MXX: DescriptionDual-Port SRAM, 2KX8, 45ns, CMOS, CQCC52, CERAMIC, LCC-52; Categorystorage storage; File Size367KB，18 Pages; ManufacturerCypress Semiconductor

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5962-9062008MXX Overview

Dual-Port SRAM, 2KX8, 45ns, CMOS, CQCC52, CERAMIC, LCC-52

5962-9062008MXX Parametric

Parameter Name	Attribute value
Parts packaging code	LCC
package instruction	QCCN,
Contacts	52
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	45 ns
JESD-30 code	S-CQCC-N52
memory density	16384 bit
Memory IC Type	DUAL-PORT SRAM
memory width	8
Number of functions	1
Number of terminals	52
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	QUAD
Base Number Matches	1

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Description	Dual-Port SRAM, 2KX8, 45ns, CMOS, CQCC52, CERAMIC, LCC-52	Dual-Port SRAM, 2KX8, 45ns, CMOS, CDIP48, CERAMIC, DIP-48	Dual-Port SRAM, 2KX8, 55ns, CMOS, CDIP48, CERAMIC, DIP-48	Dual-Port SRAM, 2KX8, 35ns, CMOS, CDIP48, CERAMIC, DIP-48	Dual-Port SRAM, 2KX8, 45ns, CMOS, CQCC52, CERAMIC, LCC-52	Dual-Port SRAM, 2KX8, 35ns, CMOS, CQCC52, CERAMIC, LCC-52	Dual-Port SRAM, 2KX8, 35ns, CMOS, CQCC52, CERAMIC, LCC-52	Dual-Port SRAM, 2KX8, 55ns, CMOS, CQCC52, CERAMIC, LCC-52	Dual-Port SRAM, 2KX8, 55ns, CMOS, CDIP48, CERAMIC, DIP-48
Parts packaging code	LCC	DIP	DIP	DIP	LCC	LCC	LCC	LCC	DIP
package instruction	QCCN,	DIP, DIP48,.6	DIP, DIP48,.6	DIP, DIP48,.6	QCCN,	QCCN, LCC52,.75SQ	QCCN,	QCCN, LCC52,.75SQ	DIP, DIP48,.6
Contacts	52	48	48	48	52	52	52	52	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	45 ns	45 ns	55 ns	35 ns	45 ns	35 ns	35 ns	55 ns	55 ns
JESD-30 code	S-CQCC-N52	R-GDIP-T48	R-GDIP-T48	R-GDIP-T48	S-CQCC-N52	S-CQCC-N52	S-CQCC-N52	S-CQCC-N52	R-GDIP-T48
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	52	48	48	48	52	52	52	52	48
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP	DIP	DIP	QCCN	QCCN	QCCN	QCCN	DIP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal location	QUAD	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1
I/O type	-	COMMON	COMMON	COMMON	-	COMMON	-	COMMON	COMMON
Number of ports	-	2	2	2	-	2	-	2	2
Output characteristics	-	3-STATE	3-STATE	3-STATE	-	3-STATE	-	3-STATE	3-STATE
Encapsulate equivalent code	-	DIP48,.6	DIP48,.6	DIP48,.6	-	LCC52,.75SQ	-	LCC52,.75SQ	DIP48,.6
power supply	-	5 V	5 V	5 V	-	5 V	-	5 V	5 V
Maximum standby current	-	0.015 A	0.015 A	0.015 A	-	0.015 A	-	0.015 A	0.015 A
Minimum standby current	-	4.5 V	4.5 V	4.5 V	-	4.5 V	-	4.5 V	4.5 V
Maximum slew rate	-	0.12 mA	0.12 mA	0.17 mA	-	0.17 mA	-	0.12 mA	0.12 mA
Terminal pitch	-	2.54 mm	2.54 mm	2.54 mm	-	1.27 mm	-	1.27 mm	2.54 mm

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