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3SMAJ5922B-TPX01

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size338KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

3SMAJ5922B-TPX01 Overview

Zener Diode,

3SMAJ5922B-TPX01 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Reach Compliance Codeunknown
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
3SMAJ5913B-TPX01
THRU
3SMAJ5943B-TPX01
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
Surface Mount Application
3.3V thru 56 Volt Voltage Range
Low Inductance , Low Profile Mounting
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Glass Passivated Junction
High specified maximum current (IZM) when adequately heat sinking
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)
H



J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
Note:
1.
2.
3.
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
D
B
R
thJL
25
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Forward Current @ 200mA.
Mounted on 5.0mm2 (1oz thick) Iand areas.
Lead temperature at TL=75
o
C
0.070"
0.085"
Revision:
B
www.mccsemi.com
1 of 4
2012/06/05
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