Bus Driver, 1-Func, 10-Bit, True Output, TTL, CDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Control type | ENABLE LOW |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.048 A |
| Number of digits | 10 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 90 mA |
| Prop。Delay @ Nom-Sup | 7.5 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54F827SDM | 54F827FM | |
|---|---|---|
| Description | Bus Driver, 1-Func, 10-Bit, True Output, TTL, CDIP24, | Bus Driver, 1-Func, 10-Bit, True Output, TTL, CDFP24, |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Fairchild | Fairchild |
| package instruction | DIP, DIP24,.3 | DFP, FL24,.4 |
| Reach Compliance Code | unknown | unknown |
| Control type | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-XDIP-T24 | R-XDFP-F24 |
| JESD-609 code | e0 | e0 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.048 A | 0.048 A |
| Number of digits | 10 | 10 |
| Number of functions | 1 | 1 |
| Number of terminals | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DFP |
| Encapsulate equivalent code | DIP24,.3 | FL24,.4 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK |
| power supply | 5 V | 5 V |
| Maximum supply current (ICC) | 90 mA | 90 mA |
| Prop。Delay @ Nom-Sup | 7.5 ns | 7.5 ns |
| Certification status | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | TTL | TTL |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |