5962-9213202MYA datasheet, PDF

5962-9213202MYA: DescriptionFast Page DRAM, 64KX4, 120ns, CMOS, CQCC18, CERAMIC, LCC-18; Categorystorage storage; File Size30KB，1 Pages; ManufacturerMicross; Websitehttps://www.micross.com

Download Datasheet Parametric View All

5962-9213202MYA Overview

Fast Page DRAM, 64KX4, 120ns, CMOS, CQCC18, CERAMIC, LCC-18

Parameter Name	Attribute value
Maker	Micross
Parts packaging code	LCC
package instruction	QCCN,
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	120 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 code	R-CQCC-N18
JESD-609 code	e0
memory density	262144 bit
Memory IC Type	FAST PAGE DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	18
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX4
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Certification status	Not Qualified
refresh cycle	256
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	QUAD
Base Number Matches	1

The first batch of LaunchPads received, thanks to TI and EEWORD: I went to attend TI's seminar yesterday, but I didn't win any prizes, which made me very upset (the first prize was ITouch), but today I received this. Hehe, I'm still very excited....; longdregon Microcontroller MCU

Vibration information authentication: [i=s]This post was last edited by lcdi on 2020-7-6 11:53[/i]Project BackgroundAny feature can be used as an authentication factor , so vibration can certainly be used. This design will design an authe...; lcdi ST MEMS Sensor Creative Design Competition

Introduction to semiconductor packaging: [b]Abstract[/b]: There are many types of semiconductor packaging, from DIP, SOP, QFP, PGA, BGA to CSP and then SIP, with technical indicators more advanced than the previous generation. These are all ...; songbo PCB Design

Looking for part-time electronic technology developers: I have a small medical project that collects weak electrical signals from the human body, amplifies and filters interference signals, and analyzes and feeds back the collected signals. Anyone with exp...; benin Recruitment

How to use a tflash card, a nand flash, and a usb slave device controller to create a two-drive usb disk: Previously, I used a tflash card and a USB slave device controller to implement a USB flash drive. Now I want to use a tflash card, a nand flash, and a USB slave device controller to implement a USB f...; watersondf Embedded System

Share DSP281x read and write EEPROM 24C02 programming routines: The source program is as follows: /*******************************************************************/ / */ /* Module Name : GPIO */ /* File Name : main.c */ /* Function : Read and write EEPROM 24C02...; Aguilera DSP and ARM Processors

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components