6N140A,* HCPL-675X, 83024, HCPL-570X, HCPL-177K, 5962-89810,
HCPL-573X, HCPL-673X, 5962-89785, 5962-98002
Hermetically Sealed, Low I
F
, Wide V
CC
,
High Gain Optocouplers
Data Sheet
*See matrix for available extensions.
Description
These units are single, dual, and quad channel, hermeti-
cally sealed optocouplers. The products are capable of
operation and storage over the full military temperature
range and can be purchased as either standard product
or with full MIL-PRF-38534 Class Level H or K testing or
from the appropriate DLA Drawing. All devices are man-
ufactured and tested on a MIL-PRF-38534 certified line
and are included in the DLA Qualified Manufacturers List
QML-38534 for Hybrid Microcircuits.
Each channel contains a GaAsP light emitting diode which
is optically coupled to an integrated high gain photon
detector. The high gain output stage features an open
collector output providing both lower saturation voltage
and higher signaling speed than possible with conven-
tional photo-Darlington optocouplers. The shallow depth
and small junctions offered by the IC process provides
better radiation immunity than conventional photo tran-
sistor optocouplers.
The supply voltage can be operated as low as 2.0 V without
adversely affecting the parametric performance.
These devices have a 300% minimum CTR at an input
current of only 0.5 mA making them ideal for use in low
input current applications such as MOS, CMOS, low power
logic interfaces or line receivers. Compatibility with high
voltage CMOS logic systems is assured by specifying I
CCH
and I
OH
at 18 Volts.
Features
Dual marked with device part number and DLA
drawing number
Manufactured and tested on a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five hermetically sealed package configurations
Performance guaranteed over full military temperature
range: -55°C to +125°C
Low input current requirement: 0.5 mA
High current transfer ratio: 1500% typical @ I
F
= 0.5 mA
Low output saturation voltage: 0.11 V typical
1500 Vdc withstand test voltage
High radiation immunity
6N138/9, HCPL-2730/31 function compatibility
Reliability data
Applications
Military and aerospace
High reliability systems
Telephone ring detection
Microprocessor system interface
Transportation, medical, and life critical systems
Isolated input line receiver
EIA RS-232-C line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Current loop receiver
System test equipment isolation
Process control input/output isolation
The connection of a 0.1
F bypass capacitor between V
CC
and GND is recommended.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Functional Diagram
Multiple Channel Devices Available
1
2
3
4
8
7
6
5
Upon special request, the following device selections can
be made: CTR minimum of up to 600% at 0.5 mA, and
lower output leakage current levels to 100
A.
Package styles for these parts are 8 and 16 pin DIP through
hole (case outlines P and E respectively), 16 pin DIP flat
pack (case outline F), and leadless ceramic chip carrier
(case outline 2). Devices may be purchased with a variety
of lead bend and plating options. See Selection Guide
table for details. Standard Military Drawing (SMD) parts
are available for each package and lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this data
sheet, absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance char-
acteristics shown in the figures are similar for all parts
except as noted. Additionally, the same package assembly
processes and materials are used in all devices. These simi-
larities justify the use of a common data base for die related
reliability and certain limited radiation test results.
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
Selection Guide-Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Avago Part # & Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dipped*
Butt Cut/Gold Plate
Gull Wing/Soldered*
Crew Cut/Gold Plate
Class H SMD Part #
Prescript for all below
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
Crew Cut/Gold Plate
Crew Cut/Soldered*
Class K SMD Part #
Prescript for all below
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
Crew Cut/Gold Plate
Crew Cut/Soldered*
*Solder contains lead.
Note:
1. JEDEC registered part.
16 pin DIP
Through Hole
4
V
CC
, GND
6N140A
[1]
6N140A/883B
HCPL-177K
Gold Plate
Option #200
Option #100
Option #300
Option #600
None
8302401EC
8302401EA
8302401YC
8302401YA
8302401XA
8302401ZC
8302401ZA
5962-
9800201KEC
9800201KEA
9800201KYC
9800201KYA
9800201KXA
9800201KZC
9800201KZA
8 pin DIP
Through Hole
1
None
HCPL-5700
HCPL-5701
HCPL-570K
Gold Plate
Option #200
Option #100
Option #300
Option #600
5962-
8981001PC
8981001PA
8981001YC
8981001YA
8981001XA
Available
Available
5962-
8981002KPC
8981002KPA
8981002KYC
8981002KYA
8981002KXA
Available
Available
8 pin DIP
Through Hole
2
V
CC
, GND
HCPL-5730
HCPL-5731
HCPL-573K
Gold Plate
Option #200
Option #100
Option #300
Option #600
5962-
8978501PC
8978501PA
8978501YC
8978501YA
8978501ZA
Available
Available
5962-
8978503KPC
8978503KPA
8978503KYC
8978503KYA
8978503KZA
Available
Available
16 pin Flat Pack
Unformed Leads
4
V
CC
, GND
HCPL-6750
HCPL-6751
HCPL-675K
Gold Plate
20 Pad LCCC
Surface Mount
2
None
HCPL-6730
HCPL-6731
HCPL-673K
Solder Pads*
None
8302401FC
5962-
89785022A
5962-
9800201KFC
5962-
8978504K2A
2
Functional Diagrams
16 pin DIP
Through Hole
4 Channels
1
2
16
8 pin DIP
Through Hole
1 Channel
1
8
8 pin DIP
Through Hole
2 Channels
1
8
16 pin Flat Pack
Unformed Leads
4 Channels
1
2
16
20 Pad LCCC
Surface Mount
2 Channels
15
VCC2
19
VO2
GND2
13
12
10
15
2
7
2
7
15
15
14
14
13
20
2
3
GND1
7
3
14
13
12
11
10
9
3
6
3
6
3
4
5
6
7
VCC1
4
5
6
4
5
4
5
VO1
8
12
11
7
8
10
9
8
Note: All DIP and flat pack devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate
V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 4 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in Millimeters (Inches)
Leaded Device Marking
Avago LOGO
Avago P/N
DLA SMD*
DLA SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
*QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE*
Leadless Device Marking
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD*
DLA SMD*
Avago CAGE CODE*
3
Outline Drawings
(continued)
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
Note: Dimensions in Millimeters (Inches)
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in Millimeters (Inches).
Solder Thickness 0.127 (0.005) Max.
Note: Dimensions in Millimeters (Inches).
4
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on com-
mercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in Millimeters (Inches).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and
16 pin DIP. DLA Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered
with solder dipped terminals as a standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on
commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped
leads.
4.57
(0.180)
MAX.
0.51 (0.020)
MIN.
2.29
(0.090)
2.79
(0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
300
4.57
(0.180)
MAX.
0.51 (0.020)
MIN.
2.29
(0.090)
2.79
(0.110)
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57
(0.180)
MAX.
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5°
MAX.
1.07 (0.042)
1.32 (0.052)
Note: Dimensions in Millimeters (Inches).
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on com-
mercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). Contact factory for the availability of this
option on DLA part types.
3.81 (0.150)
MIN.
MAX.
0.51 (0.020)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.25 (0.049)
7.36 (0.290)
7.87 (0.310)
3.81 (0.150)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.02 (0.040)
TYP.
Note: Dimensions in Millimeters (Inches).
Solder contains lead.
5
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