M24C01-RBN3TP/W datasheet, PDF

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M24C01-RBN3TP/W: Description1K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8; Categorystorage; File Size302KB，40 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M24C01-RBN3TP/W Overview

1K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8

M24C01-RBN3TP/W Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	2.5 V
Rated supply voltage	5 V
maximum clock frequency	0.4000 MHz
Processing package description	Plastic, DIP-8
state	DISCONTINUED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	IN-line
Terminal form	THROUGH-hole
Terminal spacing	2.54 mm
terminal coating	tin lead
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
memory width	8
organize	1K × 8
storage density	8192 deg
operating mode	Synchronize
Number of digits	1024 words
Number of digits	1K
Memory IC type	I2C/2-wire serial electrically erasable read-only memory
serial parallel	serial
Maximum TWC of write cycle	5 ms

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M24C16, M24C08

M24C04, M24C02, M24C01

16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit serial I²C bus EEPROM

Features

Supports both the 100 kHz I

C Standard-mode

and the 400 kHz I

C Fast-mode

Single supply voltage:

– 2.5 V to 5.5 V for M24Cxx-W

– 1.8 V to 5.5 V for M24Cxx-R

– 1.7 V to 5.5 V for M24Cxx-F

Write Control input

Byte and Page Write (up to 16 bytes)

Random and Sequential Read modes

Self-timed programming cycle

Automatic address incrementing

Enhanced ESD/latch-up protection

More than 1 million write cycles

More than 40-year data retention

Packages

– ECOPACK

(RoHS compliant)

Device summary

Part number

M24C16-W

M24C16

M24C16-R

M24C16-F

M24C08-W

M24C08

M24C08-R

M24C08-F

M24C04-W

M24C04

M24C04-R

M24C04-F

M24C02-W

M24C02

M24C02-R

M24C01-W

M24C01

M24C01-R

1. Only M24C08-F and M24C16-F devices are offered in

the WLCSP package.

2. Only M24C08-F devices are offered in the Thin

WLCSP package.

PDIP8 (BN)

SO8 (MN)

150 mils width

TSSOP8 (DW)

169 mils width

Table 1.

Reference

TSSOP8 (DS)

3 × 3 mm body size (MSOP)

UFDFPN8 (MB)

2 × 3 mm (MLP)

WLCSP (CS)

(1)

Thin WLCSP (CT)

(2)

May 2009

Doc ID 5067 Rev 13

1/40

www.st.com

Contents

M24C16, M24C08, M24C04, M24C02, M24C01

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3.1

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.4.1

2.4.2

2.4.3

2.4.4

Operating supply voltage V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.1

3.2

3.3

3.4

3.5

3.6

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.6.1

3.6.2

3.6.3

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 16

3.7

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.7.1

3.7.2

3.7.3

3.7.4

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2/40

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Doc ID 5067 Rev 13

List of tables

M24C16, M24C08, M24C04, M24C02, M24C01

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Operating conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

DC characteristics (M24Cxx-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

DC characteristics (M24Cxx-W, device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DC characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DC characteristics (M24Cxx-F). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AC characteristics at 400 kHz (I

C Fast-mode) (M24Cxx-W, M24Cxx-R,

M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

AC characteristics at 100 kHz (I

C Standard-mode) (M24Cxx-W,

M24Cxx-R, M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 27

M24C08: Thin WLCSP (0.3 mm height), 0.4 mm pitch, 5 bumps, package data . . . . . . . . 28

M24C16: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 28

SO8 narrow – 8 lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

TSSOP8 – 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 31

TSSOP8 3 x 3 mm – 8 lead thin shrink small outline, 3 x 3 mm body size,

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 33

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Available M24C16 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24C08 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24C04 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24C02 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24C01 products (package, voltage range, temperature grade) . . . . . . . . . . . . 36

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

4/40

Doc ID 5067 Rev 13

M24C16, M24C08, M24C04, M24C02, M24C01

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

M24C08-F WLCSP and thin WLCSP connections

(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Maximum R

value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . 10

I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 14

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 29

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 31

TSSOP8 3 x 3 mm – 8 lead thin shrink small outline, 3 x 3 mm body size,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 33

Doc ID 5067 Rev 13

5/40

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