IC,FLIP-FLOP,HEX,D TYPE,ACT-CMOS,FP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Maker | National Semiconductor（TI ） |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F16 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| MaximumI(ol) | 0.024 A |
| Number of functions | 6 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| Base Number Matches | 1 |
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