FBI5.1B1M1.......FBI5.1J1M1
5 Amp. Glass Passivated Bridge Rectifier
Dimensions in mm.
25
3.2
Plastic
Case
3.5
Voltage
100 to 600 V.
Current
5.0 A.
®
_
1
+ 0.05
+
• Glass Passivated Junction Chips.
L
7.5
7.5
10
suffix
–4
1
0.7
•
UL recognized under component index file
•
•
•
•
•
number E320541.
Lead and polarity identifications.
Case: Molded Plastic.
Ideal for printed circuit board (P.C.B.).
High surge current capability.
The plastic material carries U/L recognition 94 V-O.
17.5
8
• Mounting Instructions
•
High temperature soldering guaranteed: 260 ºC – 10 sc.
•
Recommended mounting torque: 8 Kg.cm.
Maximum Ratings, according to IEC publication No. 134
FBI5.1B
1M1
FBI5.1D
1M1
200
140
80
FBI5.1F
1M1
300
210
125
FBI5.1J
1M1
600
420
250
V
RRM
V
RMS
V
R
I
F(AV)
I
FRM
I
FSM
I
2
t
V
DIS
T
j
T
stg
Peak Recurrent Reverse Voltage (V)
Maximum RMS Voltage (V)
Recommended Input Voltage (V)
Max. Average forward current with heatsink
without heatsink
Recurrent peak forward current
10 ms. peak forward surge current
I
2
t value for fusing (t = 10 ms)
Dielectric strength
(terminals to case, AC 1 min.)
Operating temperature range
Storage temperature range
100
70
40
5.0 A at 100 ºC
3.0 A at 25 ºC
30 A
400 A
800 A
2
sec
1500 V
– 40 to + 150 °C
– 40 to +150 ºC
Electrical Characteristics at Tamb = 25°C
V
F
I
R
R
th (j-c)
R
th (j-a)
Max. forward voltage drop per element at I
F
= 5 A
Max. reverse current per element at V
RRM
MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.
1.1 V
5 A
2.2 ºC/W
22 ºC/W
Dec - 08
FBI5.1 - 1M1
Characteristic Curves
TYPICAL FORWARD CHARACTERISTIC
Tamb = 25° C
FORWARD CURRENT DERATING CURVE
5
heatsink
Tc
Tc
10
4
_
+
sine wave
R-load
on heatsink
1.0
3
2
on glass-epoxi substrate
0.1
_
+
1
P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air
0
0.6
1.0
1.4
V
F
, instantaneous forward voltage (V)
0
0
25
50
75 100 125 150 175
Tamb, ambient temperature (°C)
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
400
300
200
100
0
1
10
Number of cycles at 50 Hz.
100
Dec - 08