5962-01-077-4284 datasheet, PDF

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5962-01-077-4284: DescriptionIC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,PLASTIC; Categorystorage storage; File Size645KB，14 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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5962-01-077-4284 Overview

IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,PLASTIC

5962-01-077-4284 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Reach Compliance Code	not_compliant
Maximum access time	200 ns
I/O type	SEPARATE
JESD-30 code	R-PDIP-T16
memory density	16384 bit
Memory IC Type	PAGE MODE DRAM
memory width	1
Number of terminals	16
word count	16384 words
character code	16000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	+-5,12 V
Certification status	Not Qualified
refresh cycle	128
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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Description	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,PLASTIC	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,PLASTIC	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,CERAMIC	IC IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,PLASTIC, Dynamic RAM	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,CERAMIC	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,CERAMIC	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,CERAMIC	IC IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,CERAMIC, Dynamic RAM	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,CERAMIC	IC,DRAM,PAGE MODE,16KX1,MOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	200 ns	250 ns	150 ns	300 ns	250 ns	150 ns	250 ns	200 ns	200 ns	150 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM	PAGE MODE DRAM
memory width	1	1	1	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	16	16	16	16
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000	16000	16000	16000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1	16KX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	+-5,12 V	+-5,12 V	+-5,12 V	+-5,12 V	+-5,12 V	+-5,12 V	+-5,12 V	+-5,12 V	+-5,12 V	+-5,12 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	128	128	128	128	128	128	128	128	128	128
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
package instruction	-	-	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3

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