Aerospace Electronics
32K x 8 STATIC RAM—SOI
FEATURES
RADIATION
• Fabricated with RICMOS
™
IV Silicon on Insulator (SOI)
0.75
µm
Process (L
eff
= 0.6
µm)
• Total Dose Hardness through 1x10 rad(SiO
2
)
• Neutron Hardness through 1x10
14
cm
-2
• Typical Operating power < 15 mW/MHz
• Dynamic and Static Transient Upset Hardness
through 1x10
11
rad(Si)/s
• Dose Rate Survivability through 1x10
12
rad(Si)/s
• Soft Error Rate of <1x10
-10
upsets/bit-day
in Geosynchronous Orbit
• Latchup Free
• Asynchronous Operation
• CMOS or TTL Compatible I/O
• Single 5 V
±
10% Power Supply
6
HX6356
OTHER
• Listed On SMD# 5962-95845
• Fast Read/Write Cycle Times
≤
17 ns (Typical)
≤
25 ns (-55 to 125°C)
• Packaging Options
- 36-Lead CFP—Bottom Braze (0.630 in. x 0.650 in.)
- 36-Lead CFP—Top Braze (0.630 in. x 0.650 in.)
GENERAL DESCRIPTION
The 32K x 8 Radiation Hardened Static RAM is a high
performance 32,768 word x 8-bit static random access
memory with industry-standard functionality. It is fabricated
with Honeywell’s radiation hardened technology, and is
designed for use in systems operating in harsh, transient
radiation environments. The RAM operates over the full
military temperature range and requires only a single 5 V
±
10% power supply. The RAM is available with either TTL or
CMOS compatible I/O. Power consumption is typically less
than 15 mW/MHz in operation, and less than 5 mW when
de-selected. The RAM read operation is fully asynchro-
nous, with an associated typical access time of 14 ns at 5V.
Honeywell’s enhanced SOI RICMOS
™
IV (Radiation Insen-
sitive CMOS) technology is radiation hardened through the
use of advanced and proprietary design, layout and pro-
cess hardening techniques. The RICMOS
™
IV process is a
5-volt, SIMOX CMOS technology with a 150 Å gate oxide
and a minimum drawn feature size of 0.75
µm
(0.6
µm
effective gate length—L
eff
). Additional features include
tungsten via plugs, Honeywell’s proprietary SHARP pla-
narization process, and a lightly doped drain (LDD) struc-
ture for improved short channel reliability. A 7 transistor
(7T) memory cell is used for superior single event upset
hardening, while three layer metal power bussing and the
low collection volume SIMOX substrate provide improved
dose rate hardening.
HX6356
FUNCTIONAL DIAGRAM
A:0-8,12-13
11
Row
Decoder
•
•
•
32,768 x 8
Memory
Array
•
•
•
CE
NCS
Column Decoder
Data Input/Output
NWE
WE • CS • CE
8
8
DQ:0-7
NOE
NWE • CS • CE • OE
(0 = high Z)
Signal
1 = enabled
#
Signal
A:9-11, 14
4
All controls must be
enabled for a signal to
pass. (#: number of
buffers, default = 1)
SIGNAL DEFINITIONS
A: 0-14
DQ: 0-7
NCS
Address input pins which select a particular eight-bit word within the memory array.
Bidirectional data pins which serve as data outputs during a read operation and as data inputs during a write
operation.
Negative chip select, when at a low level allows normal read or write operation. When at a high level NCS
forces the SRAM to a precharge condition, holds the data output drivers in a high impedance state and
disables all input buffers except CE. If this signal is not used it must be connected to VSS.
Negative write enable, when at a low level activates a write operation and holds the data output drivers in a
high impedance state. When at a high level NWE allows normal read operation.
Negative output enable, when at a high level holds the data output drivers in a high impedance state. When
at a low level, the data output driver state is defined by NCS, NWE and CE. If this signal is not used it must
be connected to VSS.
Chip enable, when at a high level allows normal operation. When at a low level CE forces the SRAM to a
precharge condition, holds the data output drivers in a high impedance state and disables all the input buffers
except the NCS input buffer. If this signal is not used it must be connected to VDD.
NWE
NOE
CE
TRUTH TABLE
NCS
L
L
H
X
CE
H
H
X
L
NWE
H
L
XX
XX
NOE
L
X
XX
XX
MODE
Read
Write
Deselected
Disabled
DQ
Data Out
Data In
High Z
High Z
Notes:
X: VI=VIH or VIL
XX: VSS≤VI≤VDD
NOE=H: High Z output state maintained for
NCS=X, CE=X, NWE=X
2
HX6356
RADIATION CHARACTERISTICS
Total Ionizing Radiation Dose
The SRAM will meet all stated functional and electrical
specifications over the entire operating temperature range
after the specified total ionizing radiation dose. All electrical
and timing performance parameters will remain within
specifications after rebound at VDD = 5.5 V and T =125°C
extrapolated to ten years of operation. Total dose hardness
is assured by wafer level testing of process monitor transis-
tors and RAM product using 10 keV X-ray and Co60
radiation sources. Transistor gate threshold shift correla-
tions have been made between 10 keV X-rays applied at a
dose rate of 1x10
5
rad(SiO
2
)/min at T = 25°C and gamma
rays (Cobalt 60 source) to ensure that wafer level X-ray
testing is consistent with standard military radiation test
environments.
The SRAM will meet any functional or electrical specifica-
tion after exposure to a radiation pulse up to the transient
dose rate survivability specification, when applied under
recommended operating conditions. Note that the current
conducted during the pulse by the RAM inputs, outputs,
and power supply may significantly exceed the normal
operating levels. The application design must accommo-
date these effects.
Neutron Radiation
The SRAM will meet any functional or timing specification
after exposure to the specified neutron fluence under
recommended operating or storage conditions. This as-
sumes an equivalent neutron energy of 1 MeV.
Transient Pulse Ionizing Radiation
The SRAM is capable of writing, reading, and retaining
stored data during and after exposure to a transient
ionizing radiation pulse up to the transient dose rate upset
specification, when applied under recommended operat-
ing conditions. To ensure validity of all specified perfor-
mance parameters before, during, and after radiation
(timing degradation during transient pulse radiation (tim-
ing degradation during transient pulse radiation is
≤10%),
it is suggested that stiffening capacitance be placed on or
near the package VDD and VSS, with a maximum induc-
tance between the package (chip) and stiffening capaci-
tance of 0.7 nH per part. If there are no operate-through
or valid stored data requirements, typical circuit board
mounted de-coupling capacitors are recommended.
Soft Error Rate
The SRAM has an extremely low Soft Error Rate (SER) as
specified in the table below. This hardness level is defined
by the Adams 90% worst case cosmic ray environment.
The low SER is achieved by the use of a unique 7-transistor
memory cell and the oxide isolation of the SOI substrate.
Latchup
The SRAM will not latch up due to any of the above radiation
exposure conditions when applied under recommended
operating conditions. Fabrication with the SIMOX substrate
material provides oxide isolation between adjacent PMOS
and NMOS transistors and eliminates any potential SCR
latchup structures. Sufficient transistor body tie connec-
tions to the p- and n-channel substrates are made to ensure
no source/drain snapback occurs.
RADIATION HARDNESS RATINGS (1)
Parameter
Total Dose
Transient Dose Rate Upset
Transient Dose Rate Survivability
Soft Error Rate
Neutron Fluence
Limits (2)
≥1x10
6
≥1x10
11
≥1x10
12
<1x10
-10
≥1x10
14
Units
rad(SiO
2
)
rad(Si)/s
rad(Si)/s
upsets/bit-day
N/cm
2
Test Conditions
T
A
=25°C
Pulse width
≤1 µs
Pulse width
≤50
ns, X-ray,
VDD=6.0 V, T
A
=25°C
T
A
=125°C, Adams 90%
worst case environment
1 MeV equivalent energy,
Unbiased, T
A
=25°C
(1) Device will not latch up due to any of the specified radiation exposure conditions.
(2) Operating conditions (unless otherwise specified): VDD=4.5 V to 5.5 V, -55°C to 125°C.
3
HX6356
ABSOLUTE MAXIMUM RATINGS
(1)
Rating
Symbol
VDD
VPIN
TSTORE
TSOLDER
PD
IOUT
VPROT
Parameter
Positive Supply Voltage (2)
Voltage on Any Pin (2)
Storage Temperature (Zero Bias)
Soldering Temperature (5 Seconds)
Total Package Power Dissipation (3)
DC or Average Output Current
ESD Input Protection Voltage (4)
Thermal Resistance (Jct-to-Case)
Junction Temperature
– 36 FP
2000
2
175
Min
-0.5
-0.5
-65
Max
6.5
VDD+0.5
150
270
2.0
25
Units
V
V
°C
°C
W
mA
V
°C/W
°C
Θ
JC
TJ
(1) Stresses in excess of those listed above may result in permanent damage. These are stress ratings only, and operation at these levels is not
implied. Frequent or extended exposure to absolute maximum conditions may affect device reliability.
(2) Voltage referenced to VSS.
(3) RAM power dissipation (IDDSB + IDDOP) plus RAM output driver power dissipation due to external loading must not exceed this specification.
(4) Class 2 electrostatic discharge (ESD) input protection. Tested per MIL-STD-883, Method 3015 by DESC certified lab.
RECOMMENDED OPERATING CONDITIONS
Description
Symbol
VDD
TA
VPIN
Parameter
Supply Voltage (referenced to VSS)
Ambient Temperature
Voltage on Any Pin (referenced to VSS)
Min
4.5
-55
-0.3
Typ
5.0
25
Max
5.5
125
VDD+0.3
Units
V
°C
V
CAPACITANCE
(1)
Symbol
CI
CO
Parameter
Input Capacitance
Output Capacitance
Typical
(1)
Worst Case
Min
Max
7
9
Units
pF
pF
Test Conditions
VI=VDD or VSS, f=1 MHz
VIO=VDD or VSS, f=1 MHz
(1) This parameter is tested during initial design characterization only.
DATA RETENTION CHARACTERISTICS
Symbol
VDR
IDR
Parameter
Data Retention Voltage
Data Retention Current
Typical
(1)
Worst Case
(2)
Min
2.5
500
330
Max
Units
V
µA
µA
Test Conditions
NCS=VDR
VI=VDR or VSS
NCS=VDD=2.5V, VI=VDD or VSS
NCS=VDD=3.0V, VI=VDD or VSS
(1) Typical operating conditions: TA= 25°C, pre-radiation.
(2) Worst case operating conditions: -55°C to +125°C, post total dose at 25°C.
4
HX6356
DC ELECTRICAL CHARACTERISTICS
Symbol
IDDSB1
Parameter
Static Supply Current
Typical Worst Case (2)
Units
(1)
Min
Max
0.2
0.2
3.4
2.8
-1
-1
CMOS
TTL
CMOS
TTL
1.7
1.5
1.5
4.0
4.0
+1
+1
0.3xV
DD
Test Conditions
VIH=VDD, IO=0
VIL=VSS, f=0MHz
NCS=VDD, IO=0,
f=40 MHz
f=1 MHz, IO=0, CE=VIH=VDD
NCS=VIL=VSS (3)
f=1 MHz, IO=0, CE=VIH=VDD
NCS=VIL=VSS (3)
VSS≤VI≤VDD
VSS≤VIO≤VDD
Output=high Z
mA
mA
mA
mA
µA
µA
V
V
V
V
IDDSBMF Standby Supply Current - Deselected
IDDOPW
IDDOPR
II
IOZ
VIL
Dynamic Supply Current, Selected
(Write)
Dynamic Supply Current, Selected
(Read)
Input Leakage Current
Output Leakage Current
Low-Level Input Voltage
0.8
3.2
0.3
0.005
0.7xV
DD
March Pattern
VDD = 4.5V
March Pattern
VDD = 5.5V
VDD = 4.5V, IOL = 10 mA
(CMOS)
= 8 mA
(TTL)
VDD = 4.5V, IOL = 200
µA
VDD = 4.5V, IOH = -5 mA
VDD = 4.5V, IOH = -200
µA
VIH
High-Level Input Voltage
2.2
0.4
0.1
4.2
V
DD
-0.1
VOL
Low-Level Output Voltage
V
V
V
V
VOH
High-Level Output Voltage
4.3
4.5
(1) Typical operating conditions: VDD= 5.0 V,TA=25°C, pre-radiation.
(2) Worst case operating conditions: VDD=4.5 V to 5.5 V, -55°C to +125°C, post total dose at 25°C.
(3) All inputs switching. DC average current.
2.9 V
Vref1
249Ω
DUT
output
Vref2
+
-
Valid high
output
+
-
Valid low
output
CL >50 pF*
*CL = 5 pF for TWLQZ, TSHQZ, TELQZ, and TGHQZ
Tester Equivalent Load Circuit
5
Embedded System
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