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54ACTQ10FM

Description
ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, FP-14
Categorylogic    logic   
File Size122KB,5 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

54ACTQ10FM Overview

ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, FP-14

54ACTQ10FM Parametric

Parameter NameAttribute value
MakerTexas Instruments
package instructionDFP,
Reach Compliance Codeunknown
seriesACT
JESD-30 codeR-GDFP-F14
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
propagation delay (tpd)9.5 ns
Certification statusNot Qualified
Maximum seat height2.032 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
width6.2865 mm
Base Number Matches1

54ACTQ10FM Related Products

54ACTQ10FM 54ACTQ10LM 54ACTQ10DM
Description ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, FP-14 ACT SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
Maker Texas Instruments Texas Instruments Texas Instruments
package instruction DFP, QCCN, DIP,
Reach Compliance Code unknown unknown unknown
series ACT ACT ACT
JESD-30 code R-GDFP-F14 S-CQCC-N20 R-GDIP-T14
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE
Number of functions 3 3 3
Number of entries 3 3 3
Number of terminals 14 20 14
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
encapsulated code DFP QCCN DIP
Package shape RECTANGULAR SQUARE RECTANGULAR
Package form FLATPACK CHIP CARRIER IN-LINE
propagation delay (tpd) 9.5 ns 9.5 ns 9.5 ns
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 2.032 mm 1.905 mm 5.08 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal form FLAT NO LEAD THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL QUAD DUAL
width 6.2865 mm 8.89 mm 7.62 mm
Base Number Matches 1 1 1
length - 8.89 mm 19.43 mm
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