(1-Form-B) solid state relay with two independently
controlled switches that use optically coupled
MOSFET technology to provide 5000V
rms
of input to
output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Dual single-pole OptoMOS relays provide a more
compact design solution than discrete single-pole
relays in a variety of applications by incorporating
both relays in a single 8-pin package.
Features
•
5000V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Small 8-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount, Tape & Reel Versions Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
PBB190
PBB190S
PBB190STR
Description
8-Lead DIP (50/Tube)
8-Lead Surface Mount (50/Tube)
8-Lead Surface Mount (1,000/Reel)
Pin Configuration
+ Control - Switch #1
- Control - Switch #1
+ Control - Switch #2
- Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
I
LOAD
10%
90%
Pb
DS-PBB190-R02
e
3
www.ixysic.com
t
off
t
on
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
LED Forward Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
(60 Seconds)
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
2
PBB190
Ratings
400
5
50
1
150
800
5000
8
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
kV
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW /
ºC
Derate linearly 6.67 mW /
ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
1
Continuous
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
LED Forward Current
To Activate
3
To Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
I
F
=0mA
I
F
=0mA, t=10ms
I
F
=0mA, I
L
=130mA
I
F
=2mA, V
L
=400V
P
I
L
R
ON
I
LEAK
t
on
t
off
C
OUT
-
-
-
-
-
-
-
-
-
-
-
-
-
11
130
±400
25
1
1
2.5
-
mA
rms
/ mA
DC
mA
P
A
I
F
=5 mA, V
L
=10V
I
F
=5mA, V
L
=50V, f=1MHz
ms
pF
I
L
=130mA
-
I
F
=5mA
V
R
=5V
-
I
F
V
F
I
R
C
I/O
-
0.2
0.9
-
-
0.38
0.35
1.2
-
3
2
-
1.4
10
-
mA
V
µA
pF
If both poles operate simultaneously, then the load current must be derated so that the package power dissipation value is not exceeded.
Measurement taken within 1 second of on-time.
For high temperature operation (>60ºC), a LED forward current of 4mA is recommended.
2
www.ixysic.com
R02
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
PBB190
30
25
Device Count (N)
20
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA)
20
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA)
Device Count (N)
0.714 0.716 0.718 0.720 0.722 0.724 0.726 0.728
Device Count (N)
15
15
20
15
10
5
0
1.235 1.240 1.245 1.250 1.255 1.260 1.265
LED Forward Voltage (V)
10
10
5
5
0
Turn-On Time (ms)
0
0.838 0.920 1.002 1.084 1.166 1.248 1.330 1.412
Turn-Off Time (ms)
20
Typical LED Forward Current
to Activate
(N=50, I
L
=100mA)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=0mA, I
L
=100mA)
25
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, I
F
=2mA)
Device Count (N)
Device Count (N)
15
10
5
0
0.29 0.32 0.35 0.38 0.41 0.44 0.47 0.50
LED Forward Current (mA)
13.0
13.3
13.5 13.8 14.0 14.3
On-Resistance ( )
14.5
Device Count (N)
460 465
470 475 480 485 490
Blocking Voltage (V
P
)
495
LED Forward Voltage
vs. LED Forward Current
50
LED Forward Current (mA)
40
30
20
10
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage (V)
735
730
725
720
715
710
0
Typical Turn-On Time
vs. LED Forward Current
(I
L
=100mA)
Turn-Off Time ( s)
6000
5000
4000
3000
2000
1000
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=100mA)
Turn-On Time ( s)
10
20
30
40
LED Forward Current (mA)
50
0
10
20
30
40
LED Forward Current (mA)
50
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.6
1.5
1.4
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=10mA
I
F
=5mA
I
F
=2mA
900
Turn-On Time ( s)
I
F
=50mA
I
F
=20mA
Turn-On Time vs. Temperature
(I
L
=75mA)
5000
4500
Turn-Off Time ( s)
4000
3500
3000
2500
2000
1500
Turn-Off Time vs. Temperature
(I
L
=75mA)
800
700
600
500
400
300
-40
I
F
=2mA
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=5mA
I
F
=2mA
I
F
=5mA
1000
-40
-20
0
20
40
60
Temperature (ºC)
80
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R02
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
LED Forward Current to Activate
vs. Temperature
(I
L
=75mA)
PBB190
0.65
LED Forward Current (mA)
0.60
20
19
On Resistance ( )
On-Resistance
vs. Temperature
(I
F
=0mA, I
L
=75mA)
0.15
0.10
Load Current (A)
0.05
0.00
-0.05
-0.10
Typical Load Current
vs. Load Voltage
(I
F
=0mA)
18
17
16
15
14
13
0.55
0.50
0.45
0.40
0.35
-40
-20
0
20
40
60
Temperature (ºC)
80
100
12
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-0.15
-2.0 -1.5 -1.0
-0.5 0.0 0.5 1.0
Load Voltage (V)
1.5
2.0
0.14
0.13
Load Current (A)
0.12
0.11
0.10
0.09
0.08
-40
-20
Maximum Load Current
vs. Temperature
(I
F
=0mA)
Blocking Voltage (V
P
)
480
475
470
465
460
455
450
445
440
-40
Typical Blocking Voltage
vs. Temperature
(I
F
=5mA)
350
300
Leakage (nA)
250
200
150
100
50
Typical Leakage vs. Temperature
Measured Across Pins 5&6, 7&8
(I
F
=5mA, V
L
=400V)
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
140
Output Capacitance (pF)
120
100
80
60
40
20
0
0
Output Capacitance
vs. Load Voltage
(I
F
=5mA, f=1MHz)
Energy Rating Curve
1.0
0.8
0.6
0.4
0.2
0.0
10 s 100 s 1ms 10ms 100ms
Time
Load Current (A)
50
100
150
Load Voltage (V)
200
1s
10s
100s
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
www.ixysic.com
R02
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
PBB190
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PBB190 / PBB190S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PBB190 / PBB190S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.