GS81302D19E-333IT datasheet, PDF

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GS81302D19E-333IT: DescriptionDDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165; Categorystorage storage; File Size406KB，31 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS81302D19E-333IT Overview

DDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

GS81302D19E-333IT Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	FPBGA-165
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	150994944 bit
Memory IC Type	DDR SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm
Base Number Matches	1

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GS81302D07/10/19/37E-450/400/350/333/300

165-Bump BGA

Commercial Temp

Industrial Temp

Features

• 2.0 clock Latency

• Simultaneous Read and Write SigmaQuad™ Interface

• JEDEC-standard pinout and package

• Dual Double Data Rate interface

• Byte Write controls sampled at data-in time

• Burst of 4 Read and Write

• On-Die Termination (ODT) on Data (D), Byte Write (BW),

and Clock (K, K) inputs

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ pin for programmable output drive strength

• Data Valid Pin (QVLD) Support

• IEEE 1149.1 JTAG-compliant Boundary Scan

• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

144Mb SigmaQuad-II+

Burst of 4 SRAM

450 MHz–300 MHz

1.8 V V

1.8 V and 1.5 V I/O

are just one element in a family of low power, low voltage

HSTL I/O SRAMs designed to operate at the speeds needed to

implement economical high performance networking systems.

Clocking and Addressing Schemes

The GS81302D07/10/19/37E SigmaQuad-II+ SRAMs are

synchronous devices. They employ two input register clock

inputs, K and K. K and K are independent single-ended clock

inputs, not differential inputs to a single differential clock input

buffer.

Each internal read and write operation in a SigmaQuad-II+ B4

RAM is four times wider than the device I/O bus. An input

data bus de-multiplexer is used to accumulate incoming data

before it is simultaneously written to the memory array. An

output data multiplexer is used to capture the data produced

from a single memory array read and then route it to the

appropriate output drivers as needed. Therefore the address

field of a SigmaQuad-II+ B4 RAM is always two address pins

less than the advertised index depth (e.g., the 16M x 8 has a

4M addressable index).

SigmaQuad™ Family Overview

The GS81302D07/10/19/37E are built in compliance with the

SigmaQuad-II+ SRAM pinout standard for Separate I/O

synchronous SRAMs. They are 150,994,944-bit (144Mb)

SRAMs. The GS81302D07/10/19/37E SigmaQuad SRAMs

Parameter Synopsis

-450

tKHKH

tKHQV

2.2 ns

0.45 ns

-400

2.5 ns

0.45 ns

-350

2.86 ns

0.45 ns

-333

3.0 ns

0.45 ns

-300

3.3 ns

0.45 ns

Rev: 1.04 4/2011

1/31

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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