1N5391GP thru 1N5399GP
Vishay General Semiconductor
Glass Passivated Junction Rectifier
Major Ratings and Characteristics
I
F(AV)
V
RRM
I
FSM
I
R
V
F
T
j
max.
1.5 A
50 V to 1000 V
50 A
5.0 µA
1.4 V
175 °C
®
ted*
aten
P
* Glass-plastic encapsulation
technique is covered by
Patent No. 3,996,602, and
brazed-lead assembly
by Patent No. 3,930,306
DO-204AC (DO-15)
Features
• Superectifier structure for High Reliability
application
• Cavity-free glass-passivated junction
• Low forward voltage drop
• Low leakage current, typical I
R
less than 0.1 µA
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Solder Dip 260 °C, 40 seconds
Mechanical Data
Case:
DO-204AC, molded epoxy over glass body
Epoxy meets UL-94V-0 Flammability rating
Terminals:
Matte tin plated leads, solderable per
J-STD-002B and JESD22-B102D
E3 suffix for commercial grade, HE3 suffix for high
reliability grade (AEC Q101 qualified)
Polarity:
Color band denotes cathode end
Typical Applications
For use in general purpose rectification of power sup-
plies, inverters, converters and freewheeling diodes
application
Maximum Ratings
(T
A
= 25 °C unless otherwise noted)
Parameter
* Maximum repetitive peak
reverse voltage
* Maximum RMS voltage
* Maximum DC blocking
voltage
* Maximum average forward
rectified current 0.375" (9.5
mm) lead length at T
L
= 70 °C
* Peak forward surge current
8.3 ms single half sine-wave
super-imposed on rated load
* Maximum full load reverse
current, full cycle average
0.375" (9.5 mm) lead length at
T
A
= 70 °C
* Operating junction and
storage temperature range
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
1N53
91GP
50
35
50
1N53
92GP
100
70
100
1N53
93GP
200
140
200
1N53
94GP
300
210
300
1N53
95GP
400
280
400
1.5
1N53
96GP
500
350
500
1N53
97GP
600
420
600
1N53
98GP
800
560
800
1N53
99GP
1000
700
1000
Unit
V
V
V
A
I
FSM
50
A
I
R(AV)
300
µA
T
J
,T
STG
- 65 to + 175
°C
Document Number 88515
14-Oct-05
www.vishay.com
1
1N5391GP thru 1N5399GP
Vishay General Semiconductor
Electrical Characteristics
(T
A
= 25 °C unless otherwise noted)
Parameter
* Maximum
instantaneous
forward voltage
* Maximum DC
reverse current at
rated DC blocking
voltage
Typical reverse
recovery time
Typical junction
capacitance
Test condition
at 1.5 A T
A
= 70 °C
Symbol
V
F
1N53
91GP
1N53
92GP
1N53
93GP
1N53
94GP
1N53
95GP
1.4
1N53
96GP
1N53
97GP
1N53
98GP
1N53
99GP
Unit
V
T
A
= 25 °C
T
A
= 150 °C
I
R
5.0
300
µA
at I
F
= 0.5 A,
I
R
= 1.0 A, I
rr
= 0.25 A
at 4.0V, 1MHz
t
rr
C
J
2.0
15
µs
pF
Thermal Characteristics
(T
A
= 25 °C unless otherwise noted)
Parameter
Typical thermal resistance
(1)
Notes:
(1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, P.C.B. mounted
*JEDEC registered values
Symbol
R
θJA
1N53
91GP
1N53
92GP
1N53
93GP
1N53
94GP
1N53
95GP
45
1N53
96GP
1N53
97GP
1N53
98GP
1N53
99GP
Unit
°C/W
Ratings and Characteristics Curves
(T
A
= 25
°C
unless otherwise noted)
2.0
50
Average Forward Rectified Current (A)
Peak Forward Surge Current (A)
T
L
, Lead
Temperature
60 Hz Resistive or
Inductive Load
T
A
, Ambient
Temperature
0.5
T
J
= T
J
max.
8.3
ms Single Half Sine-Wave
40
1.0
30
20
10
0.375" (9.5mm) Lead Length
0
0
25
50
75
100
125
150
175
0
1
10
100
Lead Temperature ( °C)
Number
of Cycles at 60 Hz
Figure 1. Forward Current Derating Curve
Figure 2. Maximum Non-repetitive Peak Forward Surge Current
www.vishay.com
2
Document Number 88515
14-Oct-05
1N5391GP thru 1N5399GP
Vishay General Semiconductor
10
100
T
J
= 25 °C
f = 1.0 MHz
V
sig
= 50mVp-p
Instantaneous Forward Current (A)
1
T
J
= 25 °C
Pulse
Width
= 300
µs
1% Duty Cycle
0.1
Junction Capacitance (pF)
10
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1
1
10
100
Instantaneous Forward
Voltage
(V)
Reverse
Voltage
(V)
Figure 3. Typical Instantaneous Forward Characteristics
Figure 5. Typical Junction Capacitance
10
100
T
J
= 125 °C
1
Transient Thermal Impedance ( °C/W)
80
100
Instantaneous Reverse Leakage
Current (µA)
10
T
J
= 75 °C
0.1
1
T
J
= 25 °C
0.01
0
20
40
60
0.1
0.01
0.1
1
10
100
Percent of Rated Peak Reverse
Voltage
(%)
t, Pulse Duration (sec.)
Figure 4. Typical Reverse Characteristics
Figure 6. Typical Transient Thermal Impedance
Package outline dimensions in inches (millimeters)
DO-204AC (DO-15)
0.034 (0.86)
0.028 (0.71)
Dia.
1.0 (25.4)
min.
0.300 (7.6)
0.230 (5.8)
0.140 (3.6)
0.104 (2.6)
Dia.
1.0 (25.4)
min.
Document Number 88515
14-Oct-05
www.vishay.com
3
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
Embedded System
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