A3P600-1FG256Y datasheet, PDF - EEWORLD Datasheet

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A3P600-1FG256Y: DescriptionField Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256; CategoryProgrammable logic devices Programmable logic; File Size10MB，220 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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A3P600-1FG256Y Overview

Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256

A3P600-1FG256Y Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
package instruction	LBGA,
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
length	17 mm
Humidity sensitivity level	3
Configurable number of logic blocks	13824
Equivalent number of gates	600000
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature
organize	13824 CLBS, 600000 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	225
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Maximum seat height	1.7 mm
Maximum supply voltage	1.575 V
Minimum supply voltage	1.425 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	17 mm
Base Number Matches	1

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Revision 13

ProASIC3 Flash Family FPGAs

with Optional Soft ARM Support

Features and Benefits

High Capacity

• 15 k to 1 M System Gates

• Up to 144 kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X

†

and LVCMOS

2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os

‡

• Programmable Output Slew Rate

†

and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities

and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations)

†

• True Dual-Port SRAM (except ×18)

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

†

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard

(AES) Decryption (except ARM

-enabled ProASIC

3 devices)

via JTAG (IEEE 1532–compliant)

†

• FlashLock

to Secure FPGA Contents

Clock Conditioning Circuit (CCC) and PLL

†

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

Embedded Memory

†

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

ARM Processor Support in ProASIC3 FPGAs

ProASIC3 Devices

Cortex-M1 Devices

System Gates

Typical Equivalent Macrocells

VersaTiles (D-flip-flops)

RAM Kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Kbits

Secure (AES) ISP

Integrated PLL in CCCs

VersaNet Globals

I/O Banks

Maximum User I/Os

Package Pins

QFN

VQFP

TQFP

PQFP

FBGA

A3P015

15,000

128

384

–

QN68

A3P030

30,000

256

768

–

QN48, QN68,

QN132

VQ100

A3P060

60,000

512

1,536

Yes

QN132

CS121

VQ100

TQ144

FG144

A3P125

125,000

1,024

3,072

Yes

133

QN132

VQ100

TQ144

PQ208

FG144

A3P250

M1A3P250

250,000

2,048

6,144

Yes

157

QN132

VQ100

PQ208

FG144/256

FG144/256/

484

PQ208

FG144/256/

484

A3P400

M1A3P400

400,000

–

9,216

Yes

194

A3P600

M1A3P600

600,000

–

13,824

108

Yes

235

• M1 ProASIC3 Devices—ARM

Cortex™-M1 Soft Processor

Available with or without Debug

A3P1000

M1A3P1000

1,000,000

–

24,576

144

Yes

300

PQ208

FG144/256/

484

Notes:

1. A3P015 is not recommended for new designs.

2. Refer to the

Cortex-M1

product brief for more information.

3. AES is not available for Cortex-M1 ProASIC3 devices.

4. Six chip (main) and three quadrant global networks are available for A3P060 and above.

5. The M1A3P250 device does not support this package.

6. For higher densities and support of additional features, refer to the

ProASIC3E Flash Family FPGAs

datasheet.

† A3P015 and A3P030 devices do not support this feature.

January 2013

‡ Supported only by A3P015 and A3P030 devices.

ProASIC3 Flash Family FPGAs

Table of Contents

ProASIC3 Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3 DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-80

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-84

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-89

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-91

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-107

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-108

Pin Descriptions

Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1

3-2

3-3

3-4

Package Pin Assignments

QN48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

QN68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

QN132 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6

CS121 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15

VQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18

TQ144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23

PQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28

FG144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39

FG256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-52

FG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-65

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13

R ev i si o n 1 3

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