EEWORLDEEWORLDEEWORLD

Part Number

Search

34-1518-11E

Description
IC Socket, DIP36, 34 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder
CategoryThe connector    socket   
File Size236KB,1 Pages
ManufacturerAries Electronics
Environmental Compliance
Download Datasheet Parametric View All

34-1518-11E Overview

IC Socket, DIP36, 34 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

34-1518-11E Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAries Electronics
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresSTANDARD: UL 94V-0
body width0.2 inch
subject depth0.173 inch
body length1.7 inch
Contact to complete cooperationGOLD (10) OVER NICKEL (50)
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact materialBRASS
Contact styleRND PIN-SKT
current rating3 A
Device slot typeIC SOCKET
Type of equipment usedDIP36
Shell materialNYLON46
JESD-609 codee4
Manufacturer's serial number518
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts34
Maximum operating temperature125 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
Series X518 Single and Dual Row
Collet Sockets with Solder Tail Pins
FEATURES:
• Aries collet sockets are available in single or dual rows.
• Cuttable to the number of pins desired to fit the application.
• Side-to-side and end-to-end stackable.
SPECIFICATIONS:
• Body material is black UL 94V-0 Glass-filled 4/6 Nylon.
• Pin body is Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-00.
• Pin body plating is either 10μ [.25μm] min. Gold per MIL-G-45204 or
200μ [5.08μm] min. 93/7 Tin/Lead per ASTM B545 or 200μ [5.08μm]
min. Tin per ASTM B545 Type 1 over 100μ [2.54μm] min. Nickel per
SAE-AMS-QQ-N-290.
• 4-fingered collet contact is Beryllium Copper Alloy per UNS C17200
ASTM-B194-01.
• Contact plating is either 200μ [5.08μm] min. 93/7 Tin/Lead per ASTM
B545 or 200μ [5.08μm] min Tin per ASTM B545 Type 1 or 10μ [.25μm]
Gold per MIL-G-45204 over 50μ min. [1.27μm] Nickel per SAE-AMS-
Note: Aries specializes in custom design and production. In addition to
QQ-N-290. Heavy 30μ [.76μm] Gold Plating also available.
the standard products shown on this page, special materials, platings,
• Contact current rating=3 Amps.
sizes, and configurations can be furnished, depending on quantities.
• Insertion Force=180 grams/pin; Withdrawal Force=90 grams/pin; Normal
Aries reserves the right to change product specifications without notice.
Force=140 grams/pin; based on a .018 [.46] dia. test lead.
ORDERING INFORMATION
• Operating temperature=221°F [105°C] Tin & Tin/Lead plating
=257°F [125°C] Gold plating.
XX-X518-1XXXX
• Insertion Force=180 grams/pin; Withdrawal Force=90 grams/pin; Normal
Optional suffix:
No. of pins:
Force=140 grams/pin; based on a .018 [.46] dia. test lead.
H=Heavy Gold
Single row: 1-40 pins
• Accepts leads .015-.025 [.38-.64] in diameter.
plating on collet
Dual row: 2-60 pins
• Accepts lead lengths from .100 [2.54] min.
T=Tin collet/ Tin
MOUNTING CONSIDERATIONS:
0=Single row
shell
•Suggested PCB hole size=.030 ± .002 [.76 ± .05] dia.
1=Dual row
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
Series
Solder tail pin
All tolerances ± .005 [.13]
unless otherwise specified
“A”=(NO. OF PINS PER ROW) X .100 [2.54]
“B”=(NO. OF PINS PER ROW - 1) X .100 [2.54]
TL=Tin/Lead collet/
Tin/Lead shell
E=Extra long solder
tail pin
Consult Data Sheet No. 12021
for Series X518 Collet Sockets
with wire wrap pins.
Plating:
0=Gold collet/Tin shell
0TL=Gold collet/
Tin/Lead Shell
1=Gold collet/Gold shell
SOLDER TAIL
EXTRA LONG “E”
12020
REV.E
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
http://www.arieselec.com • info@arieselec.com
NORTH AMERICA
Frenchtown, NJ USA
TEL:(908) 996-6841
FAX:(908) 996-3891
abc
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
Newbie learning problems
How to learn Verilog? Now I want to debug the FPGA board, but I don’t know where to start. Please give me some advice. Thank you....
tianma123 FPGA/CPLD
What version of wince is generally used for ARM9
I just started learning embedded systems and I am planning to buy a 2440 ARM9. I don't know which one is more commonly used now and what is the price range? I want to use the WINCE system. I thought W...
baozugong Embedded System
My first full payslip
I have been doing internship for a while! This is my first complete payroll! I will save it to motivate myself to work harder. I have a lot of feelings! It is not easy to get along in society! Work is...
anghost Talking about work
Power management issues that prevent Windows XP from shutting down normally
My friend Lu is very good at keeping up with the trend. He has already installed XP on his hard drive just a few days after the Chinese version of Windows XP was released. The installation went smooth...
zbz0529 Power technology
On 3G network terminals:
Integration is a revolutionary transcendence of the traditional positioning of terminals as communication tools, and is also the driving force and goal for continuous development. Integration is not o...
liudong2008lldd RF/Wirelessly
Failed calling bin2xip.exe Issue
WINCE420\PUBLIC\YM\RelDir\SAMSUN~2\PostRomImage.bat to run. makeimg: Change directory to E:\WINCE420. makeimg: run command: cmd /CE:\WINCE420\PUBLIC\YM\RelDir\SAMSUN~2\PostRomImage.bat romimage E:\WIN...
xmmant Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1186  1928  1436  1900  479  24  39  29  10  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号