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HYS6472V16200GU

Description
3.3 V 16M x 64/72-Bit SDRAM Modules 3.3 V 32M x 64/72-Bit SDRAM Modules 3.3 V 64M x 64/72-Bit SDRAM Modules
File Size88KB,17 Pages
ManufacturerSIEMENS
Websitehttp://www.infineon.com/
Download Datasheet View All

HYS6472V16200GU Overview

3.3 V 16M x 64/72-Bit SDRAM Modules 3.3 V 32M x 64/72-Bit SDRAM Modules 3.3 V 64M x 64/72-Bit SDRAM Modules

3.3 V 16M
×
64/72-Bit SDRAM Modules
3.3 V 32M
×
64/72-Bit SDRAM Modules
3.3 V 64M
×
64/72-Bit SDRAM Modules
PC100-168 pin unbuffered DIMM Modules
Preliminary Information
HYS 64/72V16200GU
HYS 64/72V32220GU
HYS 64/72V32200GU
HYS 64/72V64220GU
• 168 Pin unbuffered 8 Byte Dual-In-Line SDRAM Modules for PC main memory applications
• One bank 16M
×
64, 16M
×
72, 32M
×
64 and 32M
×
72 organization
• Two bank 32M
×
64, 32M
×
72, 64M
×
64 and 64M
×
72 organization
• Optimized for byte-write non-parity or ECC applications
• Fully PC board layout compatible to INTEL’s Rev. 1.0 module specification
• JEDEC standard Synchronous DRAMs (SDRAM)
• SDRAM Performance:
-8
-8B
100
6
Units
MHz
ns
f
CK
t
AC
Clock frequency (max.)
Clock access time
100
6
• Programmed Latencies:
Product Speed
-8
-8B
PC100
PC100
CL
2
3
t
RCD
2
2
t
RP
2
3
• Single + 3.3 V (± 0.3 V) power supply
• Programmable CAS Latency, Burst Length and Wrap Sequence
(Sequential & Interleave)
• Auto Refresh (CBR) and Self Refresh
• Decoupling capacitors mounted on substrate
• All inputs, outputs are LVTTL compatible
• Serial Presence Detect with E
2
PROM
• Utilizes 32M
×
8 SDRAMs in TSOPII-54 packages
• Uses SIEMENS 128Mbit and 256Mbit SDRAM components
• Gold contact pad
• Card Size: 133.35 mm
×
31.75 mm
×
4.00 mm
Semiconductor Group
1
1998-08-01

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