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73M2901CL-IGV

Description
Modem, 2.4kbps Data, PQFP32, TQFP-32
CategoryWireless rf/communication    Telecom circuit   
File Size408KB,18 Pages
ManufacturerTeridian Semiconductor Corporation
Websitehttp://www.teridian.com/
Download Datasheet Parametric Compare View All

73M2901CL-IGV Overview

Modem, 2.4kbps Data, PQFP32, TQFP-32

73M2901CL-IGV Parametric

Parameter NameAttribute value
MakerTeridian Semiconductor Corporation
package instructionTQFP-32
Reach Compliance Codeunknown
data rate2.4 Mbps
JESD-30 codeS-PQFP-G32
length7 mm
Number of functions1
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTQFP
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE
Certification statusNot Qualified
Maximum seat height1.2 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width7 mm
Base Number Matches1
73M2901CL
V.22bis Single Chip Modem
DATA SHEET
JULY 2005
DESCRIPTION
The 73M2901CL is a single-chip modem that
combines all the controller (DTE) and data pump
functions necessary to implement an intelligent
V.22bis data modem.
It is suited for embedded applications where a data
return channel is needed through the telephone
network such as Set top Box, Point of Sale Terminal,
Automatic
Teller
machine,
Hand
Held
Communication Device and Smart Card Reader.
This device is based on TERIDIAN Semiconductor’s
implementation of the industry standard 8032
microcontroller core with a proprietary Multiply/
ACcumulate (MAC) coprocessor; Sigma-Delta A/D
and D/A converters (CODEC); and an analog DAA
drivers. The ROM and RAM necessary to operate
the modem are contained on the device.
Additionally, the 73M2901CL provides an on-chip
oscillator and hybrid.
FEATURES
True one chip solution for embedded systems
Low power
As low as 9.5mA operating, with standby and
power down mode available
Power supply operation from 3.6V to 2.7V
Data speed:
V.22bis – 2400bps
V.22/Bell212 – 1200bps
V.21/Bell103 – 300bps
V.23 – 1200/75bps (with PAVI turnaround)
Bell202 – 1200bps
Bell202/V23 4-wire operations
International Call Progress support
FCC68, CTR21, JATE, etc.
Worldwide Caller ID capability
Type I and II support
EIA 716 compliant
DTMF generation and detection
On chip hybrid driver
Blacklisting capability
Line-In-Use and Parallel Pick-Up (911) detection
capability
Manufacturing Self Test capability
Packaging:
32 pin PLCC / 32 pin TQFP / 44 pin LQFP
BLOCK DIAGRAM
Page: 1 of 18
©
2005 TERIDIAN Semiconductor Corporation
Rev 2.0

73M2901CL-IGV Related Products

73M2901CL-IGV 73M2901CL-IH/F 73M2901CL-IGT 73M2901CL-IGV/F 73M2901CL-IGT/F 73M2901CL-IH
Description Modem, 2.4kbps Data, PQFP32, TQFP-32 Modem, 2.4kbps Data, PQCC32, LEAD FREE, PLASTIC, LCC-32 Modem, 2.4kbps Data, PQFP40, LQFP-44 Modem, 2.4kbps Data, PQFP32, LEAD FREE, TQFP-32 Modem, 2.4kbps Data, PQFP40, LEAD FREE, LQFP-44 Modem, 2.4kbps Data, PQCC32, PLASTIC, LCC-32
Maker Teridian Semiconductor Corporation Teridian Semiconductor Corporation Teridian Semiconductor Corporation Teridian Semiconductor Corporation Teridian Semiconductor Corporation Teridian Semiconductor Corporation
package instruction TQFP-32 LEAD FREE, PLASTIC, LCC-32 LQFP-44 LEAD FREE, TQFP-32 LEAD FREE, LQFP-44 PLASTIC, LCC-32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
data rate 2.4 Mbps 2.4 Mbps 2.4 Mbps 2.4 Mbps 2.4 Mbps 2.4 Mbps
JESD-30 code S-PQFP-G32 R-PQCC-J32 S-PQFP-G40 S-PQFP-G32 S-PQFP-G40 R-PQCC-J32
length 7 mm 13.995 mm 10 mm 7 mm 10 mm 13.995 mm
Number of functions 1 1 1 1 1 1
Number of terminals 32 32 40 32 40 32
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TQFP QCCJ LQFP TQFP LQFP QCCJ
Package shape SQUARE RECTANGULAR SQUARE SQUARE SQUARE RECTANGULAR
Package form FLATPACK, THIN PROFILE CHIP CARRIER FLATPACK, LOW PROFILE FLATPACK, THIN PROFILE FLATPACK, LOW PROFILE CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 3.56 mm 1.6 mm 1.2 mm 1.6 mm 3.56 mm
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
Telecom integrated circuit types MODEM MODEM MODEM MODEM MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING J BEND GULL WING GULL WING GULL WING J BEND
Terminal pitch 0.8 mm 1.27 mm 0.8 mm 0.8 mm 0.8 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
width 7 mm 11.455 mm 10 mm 7 mm 10 mm 11.455 mm
Base Number Matches 1 1 1 1 1 1
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