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FLM0910-25F

Description
RF Power Field-Effect Transistor, 1-Element, KU Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, HERMETIC SEALED PACKAGE-2
CategoryDiscrete semiconductor    The transistor   
File Size177KB,5 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
Download Datasheet Parametric View All

FLM0910-25F Overview

RF Power Field-Effect Transistor, 1-Element, KU Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, HERMETIC SEALED PACKAGE-2

FLM0910-25F Parametric

Parameter NameAttribute value
MakerFUJITSU
package instructionFLANGE MOUNT, R-CDFM-F2
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionSOURCE
ConfigurationSINGLE
Minimum drain-source breakdown voltage15 V
FET technologyMETAL-OXIDE SEMICONDUCTOR
highest frequency bandKU BAND
JESD-30 codeR-CDFM-F2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Polarity/channel typeN-CHANNEL
Certification statusNot Qualified
surface mountYES
Terminal formFLAT
Terminal locationDUAL
Transistor component materialsSILICON
Base Number Matches1
FLM0910-25F
X, Ku-Band Internally Matched FET
FEATURES
・High
Output Power: P1dB=44dBm(Typ.)
・High
Gain: G1dB=7.0dB(Typ.)
・High
PAE:
η
add
=30%(Typ.)
・Broad
Band: 9.5½10.5GHz
・Impedance
Matched Zin/Zout = 50Ω
・Hermetically
Sealed Package
DESCRIPTION
The FLM0910-25F is a power GaAs FET that is internally matched
for standard communication bands to provide optimum power and
gain in a 50Ω system.
ABSOLUTE MAXIMUM RATINGS (Case Temperature Tc=25℃)
Item
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Channel Temperature
Symbol
V
DS
V
GS
PTot
T
stg
T
ch
Rating
15
-5
93.7
-65 to +175
175
Unit
V
V
W
Recommended Operating Condition(Case Temperature Tc=25℃)
Item
DC Input Voltage
Forward Gate Current
Reverse Gate Current
Symbol
V
DS
I
GF
I
GR
R
G
=25Ω
R
G
=25Ω
Condition
Limit
Unit
V
mA
mA
10
64
-11.2
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25℃)
Item
Drain Current
Trans conductance
Pinch-off Voltage
Gate-Source Breakdown Voltage
Symbol
I
DSS
g
m
V
p
V
GSO
P
1dB
G
1dB
I
dsr
Test Conditions
V
DS
=5V , V
GS
=0V
V
DS
=5V , I
DS
=6.92A
V
DS
=5V , I
DS
=500mA
I
GS
=-500uA
V
DS
=10V
f=9.5 - 10.5 GHz
I
DS
=0.6Idss
Zs=Z
L
=50Ω
Min.
-
-
-0.5
-5.0
43
6.0
-
-
-
-
-
Limit
Typ.
10.8
10000
-1.5
-
44
7.0
6.5
30
-
1.4
-
Max.
16.2
-
-3.0
-
-
-
7.2
-
±0.6
1.6
100
Unit
A
mS
V
V
dBm
dB
A
%
dB
℃/W
Output Power at 1dB G.C.P.
Power Gain at 1dB G.C.P.
Drain Current
Power-added Efficiency
Gain Flatness
Thermal Resistance
Channel Temperature Rise
η
add
∆G
R
th
∆Tch
Channel to Case
10V X Idsr X Rth
CASE STYLE: IK
ESD
Class
G.C.P.:Gain Compression Point , S.C.L.:Single Carrier Level
2000V ½
Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kΩ)
Edition 1.2
August 2003
1

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