54F 74F219 64-Bit Random Access Memory with TRI-STATE Outputs
November 1994
54F 74F219
64-Bit Random Access Memory with TRI-STATE
Outputs
General Description
The ’F219 is a high-speed 64-bit RAM organized as a
16-word by 4-bit array Address inputs are buffered to mini-
mize loading and are fully decoded on-chip The outputs are
TRI-STATE and are in the high-impedance state whenever
the Chip Select (CS) input is HIGH The outputs are active
only in the Read mode This device is similar to the ’F189
but features non-inverting rather than inverting data out-
puts
Features
Y
Y
Y
Y
Y
TRI-STATE outputs for data bus applications
Buffered inputs minimize loading
Address decoding on-chip
Diode clamped inputs minimize ringing
Available in SOIC (300 mil only)
Commercial
74F219PC
Military
Package
Number
N16E
Package Description
16-Lead (0 300 Wide) Molded Dual-In-Line
16-Lead Ceramic Dual-In-Line
16-Lead (0 300 Wide) Molded Small Outline JEDEC
16-Lead (0 300 Wide) Molded Small Outline EIAJ
16-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
54F219DL (Note 2)
74F219SC (Note 1)
74F219SJ (Note 1)
54F219FL (Note 2)
54F219LL (Note 2)
J16A
M16B
M16D
W16A
E20A
Note 1
Devices also available in 13 reel Use suffix
e
SCX and SJX
Note 2
Military grade device with environmental and burn-in processing Use suffix
e
DLQB FLQB and LLQB
Logic Symbol
Connection Diagrams
Pin Assignment for
DIP SOIC and Flatpak
Pin Assignment
for LCC
TL F 9500–1
TL F 9500 – 2
TL F 9500 – 3
TRI-STATE is a registered trademark of National Semiconductor Corporation
C
1995 National Semiconductor Corporation
TL F 9500
RRD-B30M105 Printed in U S A
Unit Loading Fan Out
54F 74F
Pin Names
Description
UL
HIGH LOW
10 10
10 20
10 10
10 10
150 40 (33 3)
Input I
IH
I
IL
Output I
OH
I
OL
20
mA
b
0 6 mA
20
mA
b
1 2 mA
20
mA
b
0 6 mA
20
mA
b
0 6 mA
b
3 mA 24 mA (20 mA)
A
0
–A
3
CS
WE
D
0
– D
3
O
0
– O
3
Address Inputs
Chip Select Input (Active LOW)
Write Enable Input (Active LOW)
Data Inputs
TRI-STATE Data Outputs
Function Table
Inputs
CS
L
L
H
WE
L
H
X
Operation
Write
Read
Inhibit
Condition of Outputs
High Impedance
True Stored Data
High Impedance
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
Block Diagram
TL F 9500 – 4
2
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
V
CC
Pin Potential to
Ground Pin
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
TRI-STATE Output
b
65 C to
a
150 C
b
55 C to
a
125 C
b
55 C to
a
175 C
b
55 C to
a
150 C
b
0 5V to
a
7 0V
b
0 5V to
a
7 0V
b
30 mA to
a
5 0 mA
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
Note 1
Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
Note 2
Either voltage limit or current limit is sufficient to protect inputs
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
Supply Voltage
Military
Commercial
b
55 C to
a
100 C
0 C to
a
70 C
a
4 5V to
a
5 5V
a
4 5V to
a
5 5V
b
0 5V to V
CC
b
0 5V to
a
5 5V
DC Electrical Characteristics
Symbol
V
IH
V
IL
V
CD
V
OH
Parameter
Min
Input HIGH Voltage
Input LOW Voltage
Input Clamp Diode Voltage
Output HIGH
Voltage
54F 10% V
CC
54F 10% V
CC
74F 10% V
CC
74F 10% V
CC
74F 5% V
CC
74F 5% V
CC
54F 10% V
CC
74F 10% V
CC
54F
74F
54F
74F
54F
74F
74F
74F
4 75
3 75
b
0 6
b
1 2
54F 74F
Typ
Max
Units
V
08
b
1 2
V
CC
Conditions
Recognized as a HIGH Signal
Recognized as a LOW Signal
20
V
V
Min
I
IN
e b
18 mA
I
OH
I
OH
I
OH
I
OH
I
OH
I
OH
e
e
e
e
e
e
b
1 mA
b
3 mA
b
1 mA
b
3 mA
b
1 mA
b
3 mA
25
24
25
24
27
27
05
05
20 0
50
100
70
250
50
V
Min
V
OL
I
IH
I
BVI
I
CEX
V
ID
I
OD
I
IL
I
OZH
I
OZL
I
OS
I
ZZ
I
CC
Output LOW
Voltage
Input HIGH
Current
Input HIGH Current
Breakdown Test
Output HIGH
Leakage Current
Input Leakage
Test
Output Leakage
Circuit Current
Input LOW
Current
V
mA
mA
mA
V
mA
mA
mA
mA
mA
mA
mA
Min
Max
Max
Max
00
00
Max
Max
Max
Max
0 0V
Max
I
OL
e
20 mA
I
OL
e
24 mA
V
IN
e
2 7V
V
IN
e
7 0V
V
OUT
e
V
CC
I
ID
e
1 9
mA
All Other Pins Grounded
V
IOD
e
150 mV
All Other Pins Grounded
V
IN
e
0 5V (A
n
WE D
n
)
V
IN
e
0 5V (CS)
V
OUT
e
2 7V
V
OUT
e
0 5V
V
OUT
e
0V
V
OUT
e
5 25V
Output Leakage Current
Output Leakage Current
Output Short-Circuit Current
Bus Drainage Test
Power Supply Current
37
b
60
50
b
50
b
150
500
55
3
AC Electrical Characteristics
74F
Symbol
Parameter
Min
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PZH
t
PZL
t
PHZ
t
PLZ
Access Time HIGH or LOW
A
n
to O
n
Access Time HIGH or LOW
CS to O
n
Disable Time HIGH or LOW
CS to O
n
Write Recovery Time
HIGH or LOW WE to O
n
Disable Time HIGH or LOW
WE to O
n
10 0
80
35
50
20
30
65
65
40
50
T
A
e a
25 C
V
CC
e a
5 0V
C
L
e
50 pF
Typ
18 5
13 5
60
90
40
55
20 0
11 0
70
90
Max
26 0
19 0
85
13 0
60
80
28 0
15 5
10 0
13 0
54F
T
A
e a
100 C
V
CC
e
Mil
C
L
e
50 pF
Min
90
80
35
50
20
25
65
65
35
50
Max
32 0
23 0
10 5
15 0
80
10 0
37 5
17 5
12 0
15 0
74F
T
A
V
CC
e
Com
C
L
e
50 pF
Min
10 0
80
35
50
20
30
65
65
40
50
Max
27 0
20 0
95
14 0
70
90
29 0
16 5
11 0
14 0
ns
Units
ns
ns
AC Operating Requirements
74F
Symbol
Parameter
T
A
e a
25 C
V
CC
e a
5 0V
Min
t
s
(H)
t
s
(L)
t
h
(H)
t
h
(L)
t
s
(H)
t
s
(L)
t
h
(H)
t
h
(L)
t
s
(L)
t
h
(L)
t
w
(L)
Setup Time HIGH or LOW
A
n
to WE
Hold Time HIGH or LOW
A
n
to WE
Setup Time HIGH or LOW
D
n
to WE
Hold Time HIGH or LOW
D
n
to WE
Setup Time LOW
CS to WE
Hold Time LOW
CS to WE
WE Pulse Width LOW
0
0
20
20
10 0
10 0
0
0
0
60
60
Max
54F
T
A
e a
100 C
V
CC
e
Mil
Min
0
0
20
20
11 0
11 0
20
20
0
75
15 0
Max
74F
T
A
V
CC
e
Com
Min
0
0
20
20
10 0
10 0
0
0
0
ns
60
60
ns
Max
Units
ns
ns
4
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
Temperature Range Family
74F
e
Commercial
54F
e
Military
Device Type
Package Code
P
e
Plastic DIP
D
e
Ceramic DIP
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC JEDEC
SJ
e
Small Outline SOIC EIAJ
219
S
C
X
Special Variations
QB
e
Military grade device with
environmental and burn-in
processing
X
e
Devices shipped in 13 reel
Temperature Range
C
e
Commercial (0 C to
a
70 C)
L
e
Military (
b
55 C to
a
100 C)
Physical Dimensions
inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5