GS8342S18AE-250I datasheet, PDF

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GS8342S18AE-250I: DescriptionDDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165; Categorystorage storage; File Size1MB，36 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS8342S18AE-250I Overview

DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165

GS8342S18AE-250I Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA,
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	37748736 bit
Memory IC Type	DDR SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm
Base Number Matches	1

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GS8342S08/09/18/36AE-250/200/167

165-Bump BGA

Commercial Temp

Industrial Temp

Features

• Simultaneous Read and Write SigmaSIO™ Interface

• JEDEC-standard pinout and package

• Dual Double Data Rate interface

• Byte Write (x36, x18, and x9) and Nybble Write (x8) function

• DLL circuitry for wide output data valid window and future

frequency scaling

• Burst of 2 Read and Write

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ mode pin for programmable output drive strength

• IEEE 1149.1 JTAG-compliant Boundary Scan

• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

• Pin-compatible with 72Mb and 144Mb devices

36Mb Burst of 2

SigmaSIO DDR-II™ SRAM

250 MHz–167 MHz

1.8 V V

1.8 V and 1.5 V I/O

for

GS8342S08/09/18/36AE are built in compliance with the

SigmaSIO DDR-II SRAM pinout standard for Separate I/O

synchronous SRAMs. They are 37,748,736-bit (36Mb)

SRAMs. These are the first in a family of wide, very low

voltage HSTL I/O SRAMs designed to operate at the speeds

needed to implement economical high performance

networking systems.

Parameter Synopsis

-250

-200

5.0 ns

0.45 ns

-167

6.0 ns

0.5 ns

tKHKH

4.0 ns

tKHQV

0.45 ns

Rev: 1.07 8/2012

1/36

sig

SigmaSIO DDR-II™ Family Overview

n—

sco

inu

A Burst of 2 SigmaSIO DDR-II SRAM is a synchronous

device. It employs dual input register clock inputs, K and K.

The device also allows the user to manipulate the output

K clocks are routed internally to fire the output registers

instead. Each Burst of 2 SigmaSIO DDR-II SRAM also

supplies Echo Clock outputs, CQ and CQ, which are

synchronized with read data output. When used in a source

synchronous clocking scheme, the Echo Clock outputs can be

used to fire input registers at the data’s destination.

Each internal read and write operation in a SigmaSIO DDR-II

B2 RAM is two times wider than the device I/O bus. An input

data bus de-multiplexer is used to accumulate incoming data

before it is simultaneously written to the memory array. An

output data multiplexer is used to capture the data produced

from a single memory array read and then route it to the

appropriate output drivers as needed. Therefore, the address

field of a SigmaSIO DDR-II B2 is always one address pin less

than the advertised index depth (e.g., the 4M x 8 has an 2M

addressable index).

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Clocking and Addressing Schemes

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