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935314284557

Description
Multifunction Peripheral
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,69 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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935314284557 Overview

Multifunction Peripheral

935314284557 Parametric

Parameter NameAttribute value
MakerNXP
package instruction,
Reach Compliance Codeunknown
Base Number Matches1
NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX28AEC
Rev. 4,
10/2018
i.MX28
i.MX28 Applications
Processors for
Automotive Products
Package Information
Plastic package
Case MAPBGA-289, 14 x 14 mm, 0.8 mm pitch
Ordering Information
See
Table on page 3
for ordering information.
1
Introduction
1
The i.MX28 family of processors offers feature
integration suited for automotive infotainment systems
and gateway products. These AEC-Q100 qualified
products are designed for cost-optimized multimedia
systems. The i.MX28 enables many of the features only
available in high-end systems, and at a price point
suitable for all vehicles. The core of the i.MX28 is
NXP’s fast, power-efficient implementation of the
ARM926EJ-S™ core, with speeds of up to 454 MHz.
Integrated power management, USB PHY, and LCD
display controller all contribute to overall system cost
savings.
The integrated power management unit (PMU) on the
i.MX28 is composed of a triple output DC-DC switching
converter and multiple linear regulators. These provide
power sequencing for the device and its I/O peripherals
such as memories and SD cards, as well as provide
battery charging capability for Li-Ion batteries.
The i.MX28 processor includes an additional 128-Kbyte
on-chip SRAM to make the device ideal for eliminating
NXP reserves the right to change the detail specifications as may be required
to permit improvements in the design of its products.
2
3
4
5
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information and Functional
Part Differences. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Special Signal Considerations. . . . . . . . . . . . . . . . 10
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 10
3.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 17
3.3 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4 I/O AC Timing and Parameters . . . . . . . . . . . . . . . 21
3.5 Module Timing and Electrical Parameters. . . . . . . 26
Package Information and Contact Assignments . . . . . . . 58
4.1 Case MAPBGA-289, 14 x 14 mm, 0.8 mm Pitch. . 58
4.2 Ground, Power, Sense, and Reference Contact
Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.3 Signal Contact Assignments . . . . . . . . . . . . . . . . . 60
4.4 i.MX281 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.5 i.MX285 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 64
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

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Index Files: 245  24  359  1086  2011  5  1  8  22  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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