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K6X1008T2D-GB85

Description
128K X 8 STANDARD SRAM, 70 ns, PDSO32
Categorystorage    storage   
File Size103KB,9 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K6X1008T2D-GB85 Overview

128K X 8 STANDARD SRAM, 70 ns, PDSO32

K6X1008T2D-GB85 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
package instructionSOP, SOP32,.56
Reach Compliance Codecompli
Maximum access time85 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee0
memory density1048576 bi
Memory IC TypeSTANDARD SRAM
memory width8
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
Minimum standby current2 V
Maximum slew rate0.02 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
K6X1008T2D Family
Document Title
128Kx8 bit Low Power CMOS Static RAM
CMOS SRAM
Revision History
Revision No.
0.0
History
Initial draft
Draft Data
July 15, 2002
Remark
Preliminary
0.1
Revised
- Deleted 32-TSOP1-0820R, 32-TSOP1-0813.4F/R Package Type.
- Added Commercial product.
- Added 55ns product( Vcc = 3.0V~3.6V)
Revised
- Added Lead Free 32-SOP-525 Product
- Added Lead Free 32-TSOP1-0820F Product
Finalized
- Changed I
CC
from 3mA to 2mA
- Changed I
CC
2 from 25mA to 20mA
- Changed I
SB
1
(Commercial)
from 10µA to 6µA
- Changed I
SB
1
(industrial)
from 10µA to 6µA
- Changed I
SB
1
(Automotive)
from 20µA to 10µA
- Changed I
DR
(Commercial)
from 10µA to 6µA
- Changed I
DR
(industrial)
from 10µA to 6µA
- Changed I
DR
(Automotive)
from 20µA to 10µA
December 4, 2002
Preliminary
0.2
June 23, 2003
Preliminary
1.0
September 16, 2003
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions. If you have any questions, please contact the SAMSUNG branch offices.
1
Revision 1.0
September 2003
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