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5962-9669203HXA

Description
Flash, 512KX8, 90ns, CDIP32, CERAMIC, DIP-32
Categorystorage    storage   
File Size1001KB,27 Pages
ManufacturerMicross
Websitehttps://www.micross.com
Download Datasheet Parametric View All

5962-9669203HXA Overview

Flash, 512KX8, 90ns, CDIP32, CERAMIC, DIP-32

5962-9669203HXA Parametric

Parameter NameAttribute value
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time90 ns
command user interfaceNO
Data pollingYES
JESD-30 codeR-CDIP-T32
JESD-609 codee0
length42.418 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size8
Number of terminals32
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.08 mm
Department size64K
Maximum standby current0.0016 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
switch bitNO
typeNOR TYPE
width15.24 mm
Base Number Matches1
FLASH
AS29F040
512K x 8 FLASH
UNIFORM SECTOR 5.0V FLASH
MEMORY
AVAILABLE AS MILITARY
SPECIFICATIONS
• MIL-STD-883
• SMD 5962-96692
PIN ASSIGNMENT
(Top View)
32-PIN Ceramic DIP (CW)
32-pin Flatpack (F)
32-pin Lead Formed Flatpack (DCG)
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
WE\
A17
A14
A13
A8
A9
A11
OE\
A10
CE\
DQ7
DQ6
DQ5
DQ4
DQ3
FEATURES
• Single 5.0V ±10% power supply operation
• Fastest access times: 55, 60, 70, 90, 120, & 150ns
• Low power consumption:
20 mA typical active read current
30 mA typical program/erase current
1
μA
typical standby current (standard access time to
active mode)
• Flexible sector architecture
Eight uniform 64 Kbyte each
Any combination of sectors can be erased
Supports full chip erase
• Sector protection
• Embedded Algorithms Erase & Program Algorithms
• Erase Suspend/Resume
• Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
• Compatible with JEDEC standards
Pinout and software compatible with single-power-
supply FLASH
• Data\ Polling and Toggle Bits
• 20-year data retention at 125°C
32-PAD Ceramic LCC (ECA)
A12
A15
A16
A18
VCC
WE\
A17
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
4 3 2
32 31 30
5
29
1
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
A14
A13
A8
A9
A11
OE\
A10
CE\
I/O 7
OPTIONS
OPTIONS
• Timing
55ns
60ns
70ns
90ns
120ns
150ns
MARKING
CW
F
DCG
ECA
IT
XT**
883C
Q
MARKING
-55
-60
-70
-90
-120
-150
• Package Type
Ceramic DIP (600 mil)
Flatpack
Lead Formed Flatpack
Leadless Chip Carrier
• Temperature Ranges
Industrial Temperature (-40°C to +85°C)
Military Temperature (-55°C to +125°C)
883C Processing (-55°C to +125°C)
QML Processing (-55°C to +125°C)
For more products and information
please visit our web site at
www.micross.com
AS29F040
Rev. 2.3 01/10
Micross Components reserves the right to change products or specifications without notice.
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