Microprocessor, 8-Bit, 5MHz, MOS, CDIP40, CERAMIC, DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Address bus width | 16 |
| bit size | 8 |
| boundary scan | NO |
| maximum clock frequency | 5 MHz |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-GDIP-T40 |
| JESD-609 code | e0 |
| length | 52.3875 mm |
| low power mode | NO |
| Number of DMA channels | |
| Number of external interrupt devices | 5 |
| Number of serial I/Os | 1 |
| Number of terminals | 40 |
| On-chip data RAM width | |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.588 mm |
| speed | 5 MHz |
| Maximum slew rate | 200 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |
| 8085A-2/BQA | 8085A/BQA | |
|---|---|---|
| Description | Microprocessor, 8-Bit, 5MHz, MOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 3MHz, MOS, CDIP40, CERAMIC, DIP-40 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | AMD | AMD |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Contacts | 40 | 40 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C |
| Address bus width | 16 | 16 |
| bit size | 8 | 8 |
| boundary scan | NO | NO |
| maximum clock frequency | 5 MHz | 3.125 MHz |
| External data bus width | 8 | 8 |
| Format | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO |
| JESD-30 code | R-GDIP-T40 | R-GDIP-T40 |
| JESD-609 code | e0 | e0 |
| length | 52.3875 mm | 52.3875 mm |
| low power mode | NO | NO |
| Number of external interrupt devices | 5 | 5 |
| Number of serial I/Os | 1 | 1 |
| Number of terminals | 40 | 40 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum seat height | 5.588 mm | 5.588 mm |
| speed | 5 MHz | 3 MHz |
| Maximum slew rate | 200 mA | 200 mA |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | NO |
| technology | MOS | MOS |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR |
| Base Number Matches | 1 | 1 |
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